ZHCSDM6A JUNE   2013  – December 2014 DAC161S997

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 简化电路原理图
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Error Detection And Reporting
        1. 8.3.1.1 Loop Error
        2. 8.3.1.2 SPI Timeout Error (Channel Error)
        3. 8.3.1.3 Frame Error
        4. 8.3.1.4 Alarm Current
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 SPI Write
        2. 8.5.1.2 SPI Read
        3. 8.5.1.3 Optional Protected SPI Writes
          1. 8.5.1.3.1 SPI Write Error Correction
    6. 8.6 Register Maps
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 16-bit Dac And Loop Drive
        1. 9.1.1.1 DC Characteristics
        2. 9.1.1.2 DC Input-Output Transfer Function
        3. 9.1.1.3 Loop Interface
        4. 9.1.1.4 Loop Compliance
        5. 9.1.1.5 AC Characteristics
          1. 9.1.1.5.1 Step Response
          2. 9.1.1.5.2 Output Impedance
          3. 9.1.1.5.3 PSRR
          4. 9.1.1.5.4 Stability
          5. 9.1.1.5.5 Noise and Ripple
          6. 9.1.1.5.6 Digital Feedthrough
          7. 9.1.1.5.7 HART Signal Injection
          8. 9.1.1.5.8 RC Filter Limitation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Reasons for Choosing a 3.9-V Zener Diode
        2. 9.2.2.2 Loop Compliance Voltage
        3. 9.2.2.3 Selection of External BJT
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 商标

All other trademarks are the property of their respective owners.

12.2 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

12.3 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。