ZHCSRG5 January   2023

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 Related Documentation
    2. 5.2 接收文档更新通知
    3. 5.3 支持资源
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 术语表
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening
    6. 6.6 Alternate Industry Standard Compatible PCB Land Pattern
    7. 6.7 Alternate Industry Standard Compatible Stencil Opening

封装选项

机械数据 (封装 | 引脚)
  • RRB|41
散热焊盘机械数据 (封装 | 引脚)

5.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.