ZHCSBP6G October   2013  – January 2022 CSD23381F4

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 术语表
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD23381F4 Embossed Carrier Tape Dimensions

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YJC|3
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRICTYPICAL VALUESUNIT
RθJAJunction-to-Ambient Thermal Resistance(1)85°C/W
Junction-to-Ambient Thermal Resistance(2)245
(1) Device mounted on FR4 material with 1-inch2 (6.45 cm2), 2-oz. (0.071 mm thick) Cu.
(2) Device mounted on FR4 material with minimum Cu mounting area.