SLPS247E December 2009 – August 2014 CSD16340Q3
PRODUCTION DATA.
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| STATIC CHARACTERISTICS | |||||||
| BVDSS | Drain-to-Source Voltage | VGS = 0 V, IDS = 250 μA | 25 | V | |||
| IDSS | Drain-to-Source Leakage Current | VGS = 0 V, VDS = 20 V | 1 | μA | |||
| IGSS | Gate-to-Source Leakage Current | VDS = 0 V, VGS = +10/–8 V | 100 | nA | |||
| VGS(th) | Gate-to-Source Threshold Voltage | VDS = VGS, IDS = 250 μA | 0.6 | 0.85 | 1.1 | V | |
| RDS(on) | Drain-to-Source On-Resistance | VGS = 2.5 V, IDS = 20 A | 6.1 | 7.8 | mΩ | ||
| VGS = 4.5 V, IDS = 20 A | 4.3 | 5.5 | mΩ | ||||
| VGS = 8 V, IDS = 20 A | 3.8 | 4.5 | mΩ | ||||
| gƒs | Transconductance | VDS = 15 V, IDS = 20 A | 121 | S | |||
| DYNAMIC CHARACTERISTICS | |||||||
| CISS | Input Capacitance | VGS = 0 V, VDS = 12.5 V, ƒ = 1 MHz | 1050 | 1350 | pF | ||
| COSS | Output Capacitance | 730 | 950 | pF | |||
| CRSS | Reverse Transfer Capacitance | 53 | 69 | pF | |||
| Rg | Series Gate Resistance | 1.5 | 3 | Ω | |||
| Qg | Gate Charge Total (4.5 V) | VDS = 12.5 V, ID = 20 A | 6.5 | 9.2 | nC | ||
| Qgd | Gate Charge Gate-to-Drain | 1.2 | nC | ||||
| Qgs | Gate Charge Gate-to-Source | 2.1 | nC | ||||
| Qg(th) | Gate Charge at Vth | 1 | nC | ||||
| QOSS | Output Charge | VDS = 13 V, VGS = 0 V | 15 | nC | |||
| td(on) | Turn On Delay Time | VDS = 12.5 V, VGS = 4.5 V, ID = 20 A RG = 2 Ω |
4.8 | ns | |||
| tr | Rise Time | 16.1 | ns | ||||
| td(off) | Turn Off Delay Time | 13.8 | ns | ||||
| tƒ | Fall Time | 5.2 | ns | ||||
| DIODE CHARACTERISTICS | |||||||
| VSD | Diode Forward Voltage | IS = 20 A, VGS = 0 V | 0.8 | 1 | V | ||
| Qrr | Reverse Recovery Charge | VDD = 13 V, IF = 20 A, di/dt = 300 A/μs | 14.5 | nC | |||
| trr | Reverse Recovery Time | 20 | ns | ||||
| THERMAL METRIC(1)(2) | CSD16340Q3 | UNITS | |
|---|---|---|---|
| Q3 (8 PINS) | |||
| θJA | Junction-to-Ambient Thermal Resistance | 42.0 | °C/W |
| θJCtop | Junction-to-Case (top) Thermal Resistance | 20.6 | |
| θJB | Junction-to-Board Thermal Resistance | 8.8 | |
| ψJT | Junction-to-Top Characterization Parameter | 0.3 | |
| ψJB | Junction-to-Board Characterization Parameter | 8.7 | |
| θJCbot | Junction-to-Case (bottom) Thermal Resistance | 0.1 | |
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Max RθJA = 58°C/W when mounted on 1 inch2 of 2 oz. Cu. |
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Max RθJA = 162°C/W when mounted on minimum pad area of 2 oz. Cu. |









