ZHCSTF3H
June 2007 – February 2024
CDCE913
,
CDCEL913
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
EEPROM Specification
5.7
Timing Requirements: CLK_IN
5.8
Timing Requirements: SDA/SCL
5.9
Typical Characteristics
6
Parameter Measurement Information
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Control Terminal Configuration
7.3.2
Default Device Configuration
7.3.3
SDA/SCL Serial Interface
7.3.4
Data Protocol
7.4
Device Functional Modes
7.4.1
SDA/SCL Hardware Interface
7.5
Programming
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Spread-Spectrum Clock (SSC)
8.2.2.2
PLL Frequency Planning
8.2.2.3
Crystal Oscillator Start-up
8.2.2.4
Frequency Adjustment with Crystal Oscillator Pulling
8.2.2.5
Unused Inputs/Outputs
8.2.2.6
Switching Between XO and VCXO Mode
8.2.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Register Maps
9.1
SDA/SCL Configuration Registers
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
接收文档更新通知
10.3
支持资源
10.4
Trademarks
10.5
静电放电警告
10.6
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PW|14
MPDS360
散热焊盘机械数据 (封装 | 引脚)
PW|14
QFND305D
订购信息
zhcstf3h_oa
zhcstf3h_pm
10.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。