ZHCSPR7E November   1998  – October 2022 CD54HC374 , CD54HC574 , CD54HCT374 , CD54HCT574 , CD74HC374 , CD74HC574 , CD74HCT374 , CD74HCT574

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Prerequisite for Switching Characteristics
    6. 5.6 Switching Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC DW (SOIC) N (PDIP) PW (TSSOP) UNIT
20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 109.1 84.6 131.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76 72.5 72.2 °C/W
RθJB Junction-to-board thermal resistance 77.6 65.3 82.8 °C/W
ψJT Junction-to-top characterization parameter 51.5 55.3 21.5 °C/W
ψJB Junction-to-board characterization parameter 77.1 65.2 82.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.