ZHCSKT0H November   1998  – February 2020 CD4066B

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     通过数字控制逻辑进行双向信号传输
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

Application Information

In applications that employ separate power sources to drive VDD and the signal inputs, the VDD current capability should exceed VDD/RL (RL = effective external load of the four CD4066B device bilateral switches). This provision avoids any permanent current flow or clamp action on the VDD supply when power is applied or removed from the CD4066B device.

In certain applications, the external load-resistor current can include both VDD and signal-line components. To avoid drawing VDD current when switch current flows into pins 1, 4, 8, or 11, the voltage drop across the bidirectional switch must not exceed 0.8 V (calculated from ron values shown).

No VDD current flows through RL if the switch current flows into pins 2, 3, 9, or 10.