1 Features

Key Features

• Wi-Fi 6 (802.11ax)

• Bluetooth® Low Energy 5.4 in CC33x1 devices

• Companion IC to any processor or MCU host capable of running a TCP/IP stack

• Integrated 2.4/5GHz PA for complete wireless solution with up to +20.5dBm output power.

• Operating temperature: –40°C to +105°C

• Application throughput up to 50Mbps

• Wi-Fi 6
  • 2.4GHz and 5GHz, 20MHz, single spatial stream
  • MAC, baseband, and RF transceiver with support for IEEE 802.11 a/b/g/n/ax
  • OFDMA, Trigger frame, MU-MIMO (downlink), basic service set coloring, and target wake time (TWT) for improved efficiency
  • Hardware-based encryption and decryption supporting WPA2 and WPA3
  • Excellent interoperability
  • Support for 4-bit SDIO or SPI host interfaces

• Bluetooth Low Energy 5.4
  • LE coded PHYs (long range), LE 2M PHY (high speed) and advertising extension
  • Host controller interface (HCI) transport with option for UART or shared SDIO

• Enhanced security
  • Secured host interface
  • Firmware authentication
  • Anti-rollback protection

• Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
• Optional antenna diversity or selection

• 3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (for example, Thread or Zigbee)

• Power management
  • V_MAIN, V_IO, V_pp: 1.8V
  • V_PA: 3.3V
• Clock sources
  • 40-MHz XTAL fast clock
  • Internal slow clock or external 32.768kHz slow clock
• Small package size
  • Easy to design with 40-pin, 5mm × 5mm quad flat no-leaded (QFN) package, 0.4mm pitch