ZHCSPE4A
May 2021 – November 2021
CC2652P7
PRODUCTION DATA
1
特性
2
应用
3
说明
3.1
功能方框图
4
Revision History
5
Device Comparison
6
Terminal Configuration and Functions
6.1
Pin Diagram – RGZ Package (Top View)
6.2
Signal Descriptions – RGZ Package
6.3
Connections for Unused Pins and Modules
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Power Supply and Modules
7.5
Power Consumption - Power Modes
7.6
Power Consumption - Radio Modes
7.7
Nonvolatile (Flash) Memory Characteristics
7.8
Thermal Resistance Characteristics
7.9
RF Frequency Bands
7.10
Bluetooth Low Energy - Receive (RX)
7.11
Bluetooth Low Energy - Transmit (TX)
7.12
Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
7.13
Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
7.14
Timing and Switching Characteristics
7.14.1
Reset Timing
7.14.2
Wakeup Timing
7.14.3
Clock Specifications
7.14.3.1
48 MHz Crystal Oscillator (XOSC_HF)
7.14.3.2
48 MHz RC Oscillator (RCOSC_HF)
7.14.3.3
2 MHz RC Oscillator (RCOSC_MF)
7.14.3.4
32.768 kHz Crystal Oscillator (XOSC_LF)
7.14.3.5
32 kHz RC Oscillator (RCOSC_LF)
7.14.4
Synchronous Serial Interface (SSI) Characteristics
7.14.4.1
Synchronous Serial Interface (SSI) Characteristics
36
7.14.5
UART
7.14.5.1
UART Characteristics
7.15
Peripheral Characteristics
7.15.1
ADC
7.15.1.1
Analog-to-Digital Converter (ADC) Characteristics
7.15.2
DAC
7.15.2.1
Digital-to-Analog Converter (DAC) Characteristics
7.15.3
Temperature and Battery Monitor
7.15.3.1
Temperature Sensor
7.15.3.2
Battery Monitor
7.15.4
Comparators
7.15.4.1
Low-Power Clocked Comparator
7.15.4.2
Continuous Time Comparator
7.15.5
Current Source
7.15.5.1
Programmable Current Source
7.15.6
GPIO
7.15.6.1
GPIO DC Characteristics
7.16
Typical Characteristics
7.16.1
MCU Current
7.16.2
RX Current
7.16.3
TX Current
7.16.4
RX Performance
7.16.5
TX Performance
7.16.6
ADC Performance
8
Detailed Description
8.1
Overview
8.2
System CPU
8.3
Radio (RF Core)
8.3.1
Bluetooth 5.2 Low Energy
8.3.2
802.15.4 (Thread, Zigbee, 6LoWPAN)
8.4
Memory
8.5
Sensor Controller
8.6
Cryptography
8.7
Timers
8.8
Serial Peripherals and I/O
8.9
Battery and Temperature Monitor
8.10
µDMA
8.11
Debug
8.12
Power Management
8.13
Clock Systems
8.14
Network Processor
9
Application, Implementation, and Layout
9.1
Reference Designs
9.2
Junction Temperature Calculation
10
Device and Documentation Support
10.1
Device Nomenclature
10.2
Tools and Software
10.2.1
SimpleLink™ Microcontroller Platform
10.3
Documentation Support
10.4
支持资源
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RGZ|48
MPQF123F
散热焊盘机械数据 (封装 | 引脚)
RGZ|48
QFND031W
订购信息
zhcspe4a_oa
zhcspe4a_pm
7.2
ESD Ratings
VALUE
UNIT
V
ESD
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS001
(1)
All pins
±2000
V
Charged device model (CDM), per JESD22-C101
(2)
All pins
±500
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.