ZHCSAO7B December   2012  – June 2016

 

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics Curves
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fundamentals
      2. 7.1.2 Wireless Power Consortium (WPC)
      3. 7.1.3 Power Transfer
      4. 7.1.4 Communication
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Dynamic Power Limiting™
      2. 7.3.2  Option Select Pin
      3. 7.3.3  LED Indication Modes
      4. 7.3.4  Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
      5. 7.3.5  Shut Down via External Thermal Sensor or Trigger
      6. 7.3.6  Fault Handling and Indication
      7. 7.3.7  Power Transfer Start Signal
      8. 7.3.8  Power-On Reset
      9. 7.3.9  External Reset, RESET Pin
      10. 7.3.10 Trickle Charge and CS100
      11. 7.3.11 Current Monitoring Requirements
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 MSP430G2001 Low Power Supervisor
        1. 7.3.13.1 MSP430 Low Power Supervisor Details
      14. 7.3.14 All Unused Pins
  8. Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Detailed Design Procedure
        1. 8.1.1.1 Coils and Matching Capacitors
        2. 8.1.1.2 Input Regulator
        3. 8.1.1.3 Power Train
        4. 8.1.1.4 Low Power Supervisor
        5. 8.1.1.5 Disabling Low Power Supervisor Mode
  9. Layout
    1. 9.1 Layout Guidelines
  10. 10器件和文档支持
    1. 10.1 文档支持
      1. 10.1.1 相关文档 
    2. 10.2 社区资源
    3. 10.3 商标
    4. 10.4 静电放电警告
    5. 10.5 Glossary
  11. 11机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (September 2013) to B Revision

  • Added ESD 额定值表,特性 描述部分,器件功能模式应用和实施部分,电源相关建议部分,布局部分,器件和文档支持部分以及机械、封装和可订购信息部分Go
  • 器件状态目前为 NRND。Go

Changes from * Revision (December 2012) to A Revision

  • Changed pinout diagram, pin names FOD and PMOD pin SWAP.Go
  • Changed bq500211A Typical Low-Cost Application Diagram, VSENSE is pulled to GND.Go