ZHCSRC1 December   2022 BQ34Z100-R2

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Power-On Reset
    6. 6.6  Electrical Characteristics: LDO Regulator
    7. 6.7  Electrical Characteristics: Internal Temperature Sensor Characteristics
    8. 6.8  Electrical Characteristics: Low-Frequency Oscillator
    9. 6.9  Electrical Characteristics: High-Frequency Oscillator
    10. 6.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 Electrical Characteristics: ADC (Temperature and Cell Measurement) Characteristics
    12. 6.12 Electrical Characteristics: Data Flash Memory Characteristics
    13. 6.13 Timing Requirements: HDQ Communication
    14. 6.14 Timing Requirements: I2C-Compatible Interface
    15. 6.15 Typical Characteristics
  7. 7 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
          1. 8.2.2.1.1 STEP 1: Review and Modify the Data Flash Configuration Data.
          2. 8.2.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
          3. 8.2.2.1.3 STEP 3: Design and Configure the Voltage Divider.
          4. 8.2.2.1.4 STEP 4: Determine the Sense Resistor Value.
          5. 8.2.2.1.5 STEP 5: Review and Modify the Data Flash Gas Gauging Configuration, Data, and State.
          6. 8.2.2.1.6 STEP 6: Determine and Program the Chemical ID.
          7. 8.2.2.1.7 STEP 7: Calibrate.
          8. 8.2.2.1.8 STEP 8: Run an Optimization Cycle.
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Introduction
      2. 10.1.2 Power Supply Decoupling Capacitor
      3. 10.1.3 Capacitors
      4. 10.1.4 Communication Line Protection Components
    2. 10.2 Layout Example
      1. 10.2.1 Ground System
      2. 10.2.2 Kelvin Connections
      3. 10.2.3 Board Offset Considerations
      4. 10.2.4 ESD Spark Gap
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
8.2.2.1.2 STEP 2: Review and Modify the Data Flash Configuration Registers.
  • LED_Comm Configuration: See in the BQ34Z100-R2 Technical Reference Manual to aid in selection of an LED mode. Note that the pin used for the optional Alert signal is dependent upon the LED mode selected.
  • Alert Configuration: See the BQ34Z100-R2 Technical Reference Manual to aid in selection of which faults trigger the ALERT pin.
  • Number of Series Cells
  • Pack Configuration: Ensure that the VOLSEL bit is set for multicell applications and cleared for single-cell applications.