ZHCSCP1 July   2014

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 应用信息
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Down
      2. 8.3.2 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
        1. 8.4.1.1 Input Overvoltage Protection
        2. 8.4.1.2 Input Overcurrent Protection
        3. 8.4.1.3 Battery Overvoltage Protection
        4. 8.4.1.4 Thermal Protection
        5. 8.4.1.5 Enable Function
        6. 8.4.1.6 Fault Indication
  9. 9 Application and Implementation
    1. 9.1 Typical Application Circuit
      1. 9.1.1 Design Requirements
        1. 9.1.1.1 Selection of RILIM
        2. 9.1.1.2 Selection of RBAT
        3. 9.1.1.3 Selection of R(CE), R(FAULT), and R(PU)
        4. 9.1.1.4 Selection of Input and Output Bypass Capacitors
      2. 9.1.2 Detailed Design Procedures
        1. 9.1.2.1 Powering Accessories
      3. 9.1.3 Application Curves
  10. 10Power Supply Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

  • This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages. Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of PCB traces satisfy the design rules for high voltages.
  • The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD should be thermally coupled with the PCB ground plane. In most applications, this will require a copper pad directly under the IC. This copper pad should be connected to the ground plane with an array of thermal vias.
  • CIN and COUT should be located close to the IC. Other components like RILIM and RBAT should also be located close to the IC.

11.2 Layout Example

layout_slusbt8.png