ZHCSG26C March   2017  – Janaury 2020 AMC1306E05 , AMC1306E25 , AMC1306M05 , AMC1306M25

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics: AMC1306x05
    10. 7.10 Electrical Characteristics: AMC1306x25
    11. 7.11 Switching Characteristics
    12. 7.12 Insulation Characteristics Curves
    13. 7.13 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 Modulator
      3. 8.3.3 Isolation Channel Signal Transmission
      4. 8.3.4 Digital Output
      5. 8.3.5 Manchester Coding Feature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Output
      2. 8.4.2 Output Behavior in Case of a Full-Scale Input
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Digital Filter Usage
    2. 9.2 Typical Applications
      1. 9.2.1 Frequency Inverter Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Isolated Voltage Sensing
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 What To Do and What Not To Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件命名规则
        1. 12.1.1.1 隔离相关术语
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DWV|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Detailed Design Procedure

The high-side power supply (AVDD) for the AMC1306 device is derived from the power supply of the upper gate driver. Further details are provided in the Power Supply Recommendations section.

The floating ground reference (AGND) is derived from one of the ends of the shunt resistor that is connected to the negative input of the AMC1306 (AINN). If a four-pin shunt is used, the inputs of the device are connected to the inner leads and AGND is connected to one of the outer shunt leads.

Use Ohm's Law to calculate the voltage drop across the shunt resistor (VSHUNT) for the desired measured current: VSHUNT = I × RSHUNT.

Consider the following two restrictions to choose the proper value of the shunt resistor RSHUNT:

  • The voltage drop caused by the nominal current range must not exceed the recommended differential input voltage range: VSHUNT ≤ ±250 mV
  • The voltage drop caused by the maximum allowed overcurrent must not exceed the input voltage that causes a clipping output: |VSHUNT| ≤ |VClipping|

The typically recommended RC filter in front of a ΔΣ modulator to improve signal-to-noise performance of the signal path is not required for the AMC1306. By design, the input bandwidth of the analog front-end of the device is limited as specified in the Electrical Characteristics table.

For modulator output bitstream filtering, a device from TI's TMS320F2807x family of low-cost microcontrollers (MCUs) or TMS320F2837x family of dual-core MCUs is recommended. These families support up to eight channels of dedicated hardwired filter structures that significantly simplify system level design by offering two filtering paths per channel: one providing high accuracy results for the control loop and one fast response path for overcurrent detection.