ZHCSJ89B January   2019  – July 2022 ADS8353-Q1

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input: Full-Scale Range Selection
        2. 7.3.2.2 Analog Input: Single-Ended and Pseudo-Differential Configurations
      3. 7.3.3 Transfer Function
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Write to User-Programmable Registers
      3. 7.5.3 Data Read Operation
        1. 7.5.3.1 Reading User-Programmable Registers
        2. 7.5.3.2 Conversion Data Read
          1. 7.5.3.2.1 32-CLK, Dual-SDO Mode (CFR.B11 = 0, CFR.B10 = 0, Default)
          2. 7.5.3.2.2 32-CLK, Single-SDO Mode (CFR.B11 = 0, CFR.B10 = 1)
      4. 7.5.4 Low-Power Modes
        1. 7.5.4.1 STANDBY Mode
        2. 7.5.4.2 Software Power-Down (SPD) Mode
      5. 7.5.5 Frame Abort, Reconversion, or Short-Cycling
    6. 7.6 Register Maps
      1. 7.6.1 ADS8353-Q1 Registers
  8. 8Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Amplifier Selection
      2. 8.1.2 Charge Kickback Filter
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
      1.      Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

7.5.4.1 STANDBY Mode

The device supports a STANDBY mode of operation where some of the internal circuits of the device are powered down. However, if bit 6 in configuration register is set to 1 (CFR.B6 = 1), then the internal reference is not powered down and the contents of the REFDAC_A and REFDAC_B registers are retained to enable faster power-up to a normal mode of operation.

As shown in Figure 7-8, a valid write operation in frame (F) programs the configuration register with B5 set to 1 (CFR.B5 = 1) and places the device into a STANDBY mode of operation on the following CS rising edge. While in STANDBY mode, SDO_A and SDO_B output all 1s when CS is low and remain in 3-state when CS is high.

To remain in STANDBY mode, SDI must remain low in the subsequent frames.

GUID-C30F062D-50A0-44A2-8560-DC1878179F32-low.gif
N is a function of the device configuration, as described in Table 7-4.
Figure 7-8 Enter STANDBY Mode

As shown in Figure 7-9, a valid write operation in frame (F+3) writes the configuration register with B5 set to 0 (CFR.B5 = 0) and brings the device out of STANDBY mode on the following CS rising edge. Frame (F+3) must have at least 48 SCLK falling edges.

After exiting the STANDBY mode, a delay of tPU_STDBY must elapse for the internal circuits to fully power-up and resume normal operation in frame (F+4). Device configuration for frame (F+4) is determined by the status of the CFR.B[11:6] bits programmed during frame (F+3).

GUID-8F26BDEA-3B04-445C-B41E-3218A7281382-low.gif
N is a function of the device configuration, as described in Table 7-4.
Figure 7-9 Exit STANDBY Mode

See the Section 6.6 table for timing specifications for this operating mode.