SLVSKW2 January   2026 ADS1278QML-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Quality Conformance Inspection
    7. 5.7 Timing Requirements: SPI Format
    8. 5.8 Timing Requirements: Frame-Sync Format
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Sampling Aperture Matching
      2. 6.3.2  Frequency Response
        1. 6.3.2.1 High-Speed, Low-Power, And Low-Speed Modes
        2. 6.3.2.2 High-Resolution Mode
      3. 6.3.3  Phase Response
      4. 6.3.4  Settling Time
      5. 6.3.5  Data Format
      6. 6.3.6  Analog Inputs (AINP, AINN)
      7. 6.3.7  Voltage Reference Inputs (VREFP, VREFN)
      8. 6.3.8  Clock Input (CLK)
      9. 6.3.9  Mode Selection (MODE)
      10. 6.3.10 Synchronization (SYNC)
      11. 6.3.11 Power-Down ( PWDN)
      12. 6.3.12 Format[2:0]
      13. 6.3.13 Serial Interface Protocols
      14. 6.3.14 SPI Serial Interface
        1. 6.3.14.1 SCLK
        2. 6.3.14.2 DRDY/FSYNC (SPI Format)
        3. 6.3.14.3 DOUT
        4. 6.3.14.4 DIN
      15. 6.3.15 Frame-Sync Serial Interface
        1. 6.3.15.1 SCLK
        2. 6.3.15.2 DRDY/FSYNC (Frame-Sync Format)
        3. 6.3.15.3 DOUT
        4. 6.3.15.4 DIN
      16. 6.3.16 DOUT Modes
        1. 6.3.16.1 TDM Mode
        2. 6.3.16.2 TDM Mode, Fixed-Position Data
        3. 6.3.16.3 TDM Mode, Dynamic Position Data
        4. 6.3.16.4 Discrete Data Output Mode
      17. 6.3.17 Daisy-Chaining
      18. 6.3.18 Modulator Output
      19. 6.3.19 Pin Test Using Test[1:0] Inputs
      20. 6.3.20 VCOM Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

请参考 PDF 数据表获取器件具体的封装图。

5.6 Quality Conformance Inspection

MIL-STD-883, Method 5005 - Group A

SUBGROUP DESCRIPTION TEMP (°C)
1 Static tests at 25
2 Static tests at 125
3 Static tests at –55
4 Dynamic tests at 25
5 Dynamic tests at 125
6 Dynamic tests at –55
7 Functional tests at 25
8A Functional tests at 125
8B Functional tests at –55
9 Switching tests at 25
10 Switching tests at 125
11 Switching tests at –55
12 Setting time at 25
13 Setting time at 125
14 Setting time at –55