UCC27424-EP

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具有使能功能的增强型产品 4A/4A 双通道栅极驱动器

产品详情

Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 4 Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -55 to 125 Rise time (ns) 20 Fall time (ns) 15 Propagation delay time (µs) 0.025 Input negative voltage (V) 0 Rating HiRel Enhanced Product Driver configuration Dual inputs
Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 4 Input supply voltage (min) (V) 4.5 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -55 to 125 Rise time (ns) 20 Fall time (ns) 15 Propagation delay time (µs) 0.025 Input negative voltage (V) 0 Rating HiRel Enhanced Product Driver configuration Dual inputs
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High Current-Drive Capability of ±4 A
  • Unique Bipolar and CMOS True-Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL-/CMOS-Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns
    With Input Falling and 35 ns With Input Rising
  • 4.5-V to 15-V Supply Voltage
  • Dual Outputs can be Paralleled for Higher Drive
    Current
  • Available in Thermally-Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W RθJC
  • Supports Defense, Aerospace, and Medical
    Applications
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • APPLICATIONS
    • Switch-Mode Power Supplies
    • DC/DC Converters
    • Motor Controllers
    • Line Drivers
    • Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High Current-Drive Capability of ±4 A
  • Unique Bipolar and CMOS True-Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL-/CMOS-Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns
    With Input Falling and 35 ns With Input Rising
  • 4.5-V to 15-V Supply Voltage
  • Dual Outputs can be Paralleled for Higher Drive
    Current
  • Available in Thermally-Enhanced MSOP
    PowerPAD™ Package With 4.7°C/W RθJC
  • Supports Defense, Aerospace, and Medical
    Applications
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
  • APPLICATIONS
    • Switch-Mode Power Supplies
    • DC/DC Converters
    • Motor Controllers
    • Line Drivers
    • Class-D Switching Amplifiers

All other trademarks are the property of their respective owners

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424 thermally-enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.

Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left open for standard operation.

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类型 标题 下载最新的英语版本 日期
* 数据表 UCC2742x-EP Dual 4-A High-Speed Low-Side MOSFET Driver With Enable 数据表 (Rev. C) PDF | HTML 2014年 12月 23日
* 辐射与可靠性报告 UCC27424MDGNREP Reliability Report 2012年 1月 5日
应用简报 了解峰值源电流和灌电流 (Rev. A) 英语版 (Rev.A) 2020年 4月 29日
应用简报 适用于栅极驱动器的外部栅极电阻器设计指南 (Rev. A) 英语版 (Rev.A) 2020年 4月 29日

设计和开发

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仿真模型

UCC27424 PSpice Transient Model

SLUM322.ZIP (40 KB) - PSpice Model
仿真模型

UCC27424 Unencrypted PSpice Transient Model

SLUM508.ZIP (2 KB) - PSpice Model
计算工具

SLURB24 UCC2742X Schematic Review Template

支持的产品和硬件

支持的产品和硬件

产品
低侧驱动器
UCC27423 具有 5V UVLO、使能功能和反相输入的 4A/4A 双通道栅极驱动器 UCC27423-EP 具有反相输入的 4A/4A 双通道栅极驱动器(增强型产品) UCC27423-Q1 具有使能功能和反相输入的汽车类 4A/4A 双通道栅极驱动器 UCC27424 具有使能和 5V 输入电压处理功能的 4A/4A 双通道栅极驱动器 UCC27424-EP 具有使能功能的增强型产品 4A/4A 双通道栅极驱动器 UCC27424-Q1 具有使能功能的汽车类 4A/4A 双通道栅极驱动器 UCC27425 具有使能功能和反相/同相输入的 4A/4A 双通道栅极驱动器 UCC27425-Q1 具有反相/非反相输入的汽车类 4-A/4-A 双通道栅极驱动器
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HVSSOP (DGN) 8 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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