UCC2541
- On-Chip Predictive Gate Drive™ for High-Efficiency Synchronous Buck Operation
- Dual ±3-A TrueDrive™ Outputs
- On-Board Programmable Oscillator with 1-MHz Frequency Operation
- TR Input for Sequencing Operation
- Overcurrent Protection using a Parallel Average Current Mode Control Loop
- 3 Modes to Support 2.7-V to 35-V Input Bias
- Reverse Current Protection for Output Stage
- User Programmable Shutdown Using SS Pin
- ±1.0% Initial Tolerance Bandgap Reference
- High Bandwidth Error Amplifiers
- Thermally Enhanced HTSSOP 20-Pin PowerPAD™ Package and QFN-32 Pin
- Synchronization Input
- Supports Pre-Bias Applications
- APPLICATIONS
- High Efficiency Non-Isolated Converters Requiring Advanced Features such as Pre-Bias Support and Tracking Capability
- Point-of-Load Modules for Servers, Telecom, and Data communication Equipments
- Good for Input Voltages of 3.3 V, 5.0 V, 12.0 V, or Intermediate Bus Voltages
Predictive Gate Drive, TrueDrive and PowerPAD are trademarks of Texas Instruments Incorporated.
The UCC2541 is a synchronous buck PWM controller for high current and low output voltage applications.
For higher efficiency, it incorporates the Predictive Gate Drive technology that virtually eliminates body diode conduction losses in synchronous rectifiers.
The UCC2541 is available in the extended temperature range of -40°C to 105°C and is offered in thermally enhanced PowerPAD 20-pin HTSSOP (PWP) or 32-pin quad flatpack (RHB) package. This space saving package with standard 20-pin TSSOP footprint has a drastically lower thermal resistance of 1.4°C/W JC to accommodate the dual high-current drivers on board.
技术文档
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查看全部 2 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | High-Efficiency Ssynchronous Buck PWM Controller 数据表 (Rev. A) | 2005年 9月 22日 | |||
用户指南 | UCC2541 72-W Synchronous Buck Converter | 2006年 2月 24日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
封装 | 引脚 | 下载 |
---|---|---|
HTSSOP (PWP) | 20 | 查看选项 |
订购和质量
包含信息:
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
包含信息:
- 制造厂地点
- 封装厂地点