SN74LVC1G10 单路 3 输入正与非门 | 德州仪器 TI.com.cn

SN74LVC1G10 (正在供货)

单路 3 输入正与非门

单路 3 输入正与非门 - SN74LVC1G10
数据表
SN74LVC1G10 数据表  (英文內容)
 

描述

The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

特性

  • Available in the Texas Instruments NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Provides Down Translation to VCC
  • Max tpd of 3.8 ns at 3.3 V
  • Low Power Consumption, 10-μA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 100 mA per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged Device Model (C101)

查看更多内容

参数 与其它产品相比 与非门

 
Technology Family
VCC (Min) (V)
VCC (Max) (V)
Channels (#)
Inputs per channel
ICC @ Nom Voltage (Max) (mA)
IOL (Max) (mA)
IOH (Max) (mA)
Input Type
Output Type
Features
Rating
Data Rate (Max) (Mbps)
Operating Temperature Range (C)
Package Group
Package Size: mm2:W x L (PKG)
SN74LVC1G10
LVC    
1.65    
5.5    
1    
3    
0.01    
32    
-32    
Standard CMOS    
Push-Pull    
Partial Power Down (Ioff)
Over-Voltage Tolerant Inputs
Ultra High Speed (tpd <5ns)    
Catalog    
100    
-40 to 125
-40 to 85    
DSBGA | 6
SC70 | 6
SON | 6
SOT-23 | 6    
See datasheet (DSBGA)
6SC70: 4 mm2: 2.1 x 2 (SC70 | 6)
See datasheet (SON)
6SOT-23: 8 mm2: 2.8 x 2.9 (SOT-23 | 6)