SNOSA71L October   2004  – September 2015 LMP2011 , LMP2012

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: LMP2011
    5. 6.5  Thermal Information: LMP2012
    6. 6.6  2.7-V DC Electrical Characteristics
    7. 6.7  2.7-V AC Electrical Characteristics
    8. 6.8  5-V DC Electrical Characteristics
    9. 6.9  5-V AC Electrical Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 How the LMP201x Works
      2. 7.3.2 The Benefits of LMP201x: No 1/F Noise
      3. 7.3.3 No External Capacitors Required
      4. 7.3.4 Copper Leadframe
      5. 7.3.5 More Benefits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Currents
      2. 7.4.2 Overload Recovery
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Extending Supply Voltages and Output Swing with a Composite Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Results
      2. 8.2.2 Precision Strain-gauge Amplifier
      3. 8.2.3 ADC Input Amplifier
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

LMP2011/12 PSPICE Model, SNOM113

TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti

TI Filterpro Software, http://www.ti.com/tool/filterpro

DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm

TI Universal Operational Amplifier Evaluation Module, http://www.ti.com/tool/opampevm

Manual for LMH730268 Evaluation board 551012922-001

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

  • SBOA015 (AB-028), Feedback Plots Define Op Amp AC Performance
  • SLOA089, Circuit Board Layout Techniques
  • SLOD006, Op Amps for Everyone
  • TIPD128, Capacitive Load Drive Solution using an Isolation Resistor
  • SBOA092, Handbook of Operational Amplifier Applications

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LMP2011 Click here Click here Click here Click here Click here
LMP2012 Click here Click here Click here Click here Click here

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

LMP, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.