ZHCSKD5A October   2019  – August 2020 TPA3139D2

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics,
      1. 6.7.1 Bridge -Tied Load (BTL)
      2. 6.7.2 Paralleled Bridge -Tied Load (PBTL)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Gain
      2. 7.3.2  SD/ FAULT and MUTE Operation
      3. 7.3.3  PLIMIT
      4. 7.3.4  Spread Spectrum and De-Phase Control
      5. 7.3.5  GVDD Supply
      6. 7.3.6  DC Detect
      7. 7.3.7  PBTL Select
      8. 7.3.8  Short-Circuit Protection and Automatic Recovery Feature
      9. 7.3.9  Over-Temperature Protection (OTP)
      10. 7.3.10 Over-Voltage Protection (OVP)
      11. 7.3.11 Under-Voltage Protection (UVP)
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE_SEL = LOW: BD Modulation
      2. 7.4.2 MODE_SEL = HIGH: Low-Idle-Current 1SPW Modulation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 PCB Material Recommendation
        2. 8.2.1.2 PVCC Capacitor Recommendation
        3. 8.2.1.3 Decoupling Capacitor Recommendations
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Ferrite Bead Filter Considerations
        2. 8.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 8.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 8.2.2.4 Input Resistance
        5. 8.2.2.5 Input Capacitor, Ci
        6. 8.2.2.6 BSN and BSP Capacitors
        7. 8.2.2.7 Differential Inputs
        8. 8.2.2.8 Using Low-ESR Capacitors
      3. 8.2.3 Application Performance Curves
        1. 8.2.3.1 EN55013 Radiated Emissions Results
        2. 8.2.3.2 EN55022 Conducted Emissions Results
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling, CS
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • 8Ω、1% THD+N、7.4V 电源条件下，功率为 2 × 3W
  • 8Ω、1% THD+N、13.5V 电源条件下，功率为 2 × 10W
  • 开速开通时间 < 15ms
  • 宽电源电压范围：3.5V 至 14.4V
  • 具有低空闲电流且小型尺寸，适用于便携式音频应用
    • 4 x 4mm2 QFN-24 封装
    • 1SPW 调制时空闲电流为 20mA (12V)
    • > 90% 的 D 类效率
  • 灵活的音频解决方案：
    • 可实现输出快速启用和禁用的 MUTE 信号
    • 单端或差动模拟输入
    • 可选增益：20dB 和 26dB
  • 集成保护和自动恢复功能：
    • 引脚对引脚、引脚对地、引脚对电源短路保护
    • 热保护、欠压保护和过压保护
    • 功率限制器和直流扬声器保护
  • 扩频调制可降低 EMI 发射
  • 降低了解决方案尺寸和成本：
    • 采用铁氧体磁珠滤波器，符合 EN55022 EMC 标准
    • 无需外部散热器