ZHCSJW0D June   2019  – March 2020 TPS62840

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用
      2.      效率与负载电流间的关系 (VOUT = 1.8V)
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Smart Enable and Shutdown
      2. 8.3.2 Soft Start
      3. 8.3.3 Mode Selection: Power-Save Mode (PFM/PWM) or Forced PWM Operation (FPWM)
      4. 8.3.4 Output Voltage Selection (VSET)
      5. 8.3.5 Undervoltage Lockout UVLO
      6. 8.3.6 Switch Current Limit / Short Circuit Protection
      7. 8.3.7 Output Voltage Discharge
      8. 8.3.8 Thermal Shutdown
      9. 8.3.9 STOP Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Save Mode Operation
      2. 8.4.2 Forced PWM Mode Operation
      3. 8.4.3 100% Mode Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 保障资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

Thermal Information

THERMAL METRIC(1) 8 Pins DLC Package 6 Pins YBG Package 8 Pins DGR Package DGR EVM UNIT
JEDEC PCB 51-7 JEDEC PCB 51-5 TPS62841-2EVM123
RθJA Junction-to-ambient thermal resistance 105.6 133.4 54.4 46.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.7 0.4 58.1 N/A °C/W
RθJB Junction-to-board thermal resistance 31.9 39.4 25.9 N/A °C/W
ψJT Junction-to-top characterization parameter 2.3 0.1 1.2 0.9 °C/W
ψJB Junction-to-board characterization parameter 31.5 39.4 25.9 17.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 11.7 N/A °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.