ZHCSHU2B March   2018  – October 2018 TPS7A10

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      压降与 IOUT 和温度间的关系(YKA 封装)
      2.      典型应用电路
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Global Undervoltage Lockout (UVLO)
      3. 7.3.3 Active Discharge
      4. 7.3.4 Enable
      5. 7.3.5 Sequencing Requirement
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Dropout Voltage
      5. 8.1.5 Behavior During Transition From Dropout Into Regulation
      6. 8.1.6 Undervoltage Lockout Circuit Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

修订历史记录

Changes from A Revision (June 2018) to B Revision

  • Added YKA 封装 添加至以下章节的可实现最低功率损耗的超低压降 项目的子项目:Go
  • Added 在 部分中添加了最后一个句子说明 部分的关断相关文字Go
  • Changed 将 WSON (DSE) 封装从“预告信息”更改为“生产数据(正在供货)”Go
  • Added YKA 封装 添加至压降与 IOUT 和温度间的关系(YKA 封装) 一图的标题中Go
  • Added YKA Package to captions of Output Accuracy Over Temperature, YKA Package and Output Accuracy Over Temperature, YKA Package figuresGo
  • Added Output Accuracy Over Temperature, DSE Package and Output Accuracy Over Temperature, DSE Package figuresGo
  • Added YKA Package to caption of Dropout vs IIOUT and Temperature, YKA Package figureGo
  • Added Dropout vs IIOUT and Temperature, DSE Package figure Go

Changes from * Revision (March 2018) to A Revision

  • Changed 从“预告信息”更改为“生产数据(正在供货)”Go