SNVA427C January   2010  – December 2021 LMZ12003

 

  1.   Trademarks
  2. Description
  3. Packaging Highlights
  4. Demo Board Features
  5. Typical Applications
  6. Demo Board Schematic
  7. Demo Board Bill of Materials (BOM)
  8. Demo Board Hookup
  9. Demo Board Passive Components
  10. Performance Characteristics
  11. 10Revision History

Packaging Highlights

  • 7-lead module package (similar to TO-263)
  • Single exposed die attach pad for enhanced thermal performance
  • 10.2-mm × 13.8-mm × 4.6-mm module package
  • High power density
  • 1.7-inch × 2.3-inch reduced size demo board form factor