SNIS177B March   2013  – September 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT90 Transfer Function
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage –0.2 12 V
Output Voltage −1 (+VS + 0.6) V
Output Current 10 mA
Maximum Junction Temperature, TJMAX 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM)(1) 2000 V
Machine Model(1) 250
(1) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. Machine model is a 200-pF capacitor discharged directly into each pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
LMT90 (TMIN ≤ TA ≤ TMAX) −40 125 °C
Operating Temperature Range (Device is functional but performance is not specified) −40 150 °C
Supply Voltage Range (+VS) 4.5 10 V
(1) Soldering process must comply with the Reflow Temperature Profile specifications. Reflow temperature profiles are different for lead-free and non-lead-free packages. Refer to www.ti.com/packaging.

6.4 Thermal Information

THERMAL METRIC(1) LMT90 UNIT
DBZ (SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 450 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise noted, these specifications apply for VS = 5 VDC and ILOAD = 0.5 μA, in the circuit of Figure 14. All limits TA = TJ = 25°C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX(1) UNIT
Accuracy(2) –3 3 °C
TA = TMAX –4 4 °C
TA = TMIN –4 4 °C
Non-linearity(3) TA = TJ = TMIN to TMAX –0.8 0.8 °C
Sensor Gain (Average Slope) TA = TJ = TMIN to TMAX 9.7 10.3 mV/°C
Output Resistance 2000 Ω
TA = TJ = TMIN to TMAX 4000
Line Regulation(4) 4.5 V ≤ VS ≤ 10 V –0.8 0.8 mV/V
TA = TJ = TMIN to TMAX –1.2 1.2 mV/V
Quiescent Current(5) 4.5 V ≤ VS ≤ 10 V 130 μA
4.5 V ≤ VS ≤ 10 V
TA = TJ = TMIN to TMAX		 180 μA
Change of Quiescent Current(5) 4.5 V ≤ VS ≤ 10 V
TA = TJ = TMIN to TMAX		 2 μA
Temperature Coefficient of Quiescent Current TA = TJ = TMIN to TMAX 2 μA/°C
Long Term Stability(6) TJ = 125°C, for 1000 hours ±0.08 °C
(1) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(2) Accuracy is defined as the error between the output voltage and 10 mv/°C times the device's case temperature plus 500 mV, at specified conditions of voltage, current, and temperature (expressed in °C).
(3) Non-linearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range.
(4) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance.
(5) Quiescent current is defined in the circuit of Figure 14.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.

6.6 Typical Characteristics

To generate these curves the LMT90 was mounted to a printed circuit board as shown in Figure 19.
LMT90 01203021.png Figure 1. Thermal Resistance Junction to Air
LMT90 01203023.png Figure 3. Thermal Response in Still Air With Heat Sink (Figure 19)
LMT90 01203025.png Figure 5. Startup Voltage vs Temperature
LMT90 01203027.png Figure 7. Quiescent Current vs Temperature (Figure 14)
LMT90 01203029.png Figure 9. Noise Voltage
LMT90 01203031.png Figure 11. Start-Up Response
LMT90 01203022.png Figure 2. Thermal Time Constant
LMT90 01203024.png Figure 4. Thermal Response in Stirred Oil Bath With Heat Sink
LMT90 01203026.png Figure 6. Thermal Response in Still Air Without a Heat Sink
LMT90 01203028.png Figure 8. Accuracy vs Temperature
LMT90 01203030.png Figure 10. Supply Voltage vs Supply Current