SLUUAQ0C October   2013  – November 2021 TPS53513

 

  1.   Trademarks
  2. Introduction
  3. Description
    1. 2.1 Typical Applications
    2. 2.2 Features
  4. Electrical Performance Specifications
  5. Schematic
  6. Test Setup
    1. 5.1 Test Equipment
    2. 5.2 Recommended Test Setup
      1. 5.2.1 Input Connections
      2. 5.2.2 Output Connections
  7. Configurations
    1. 6.1 Switching Frequency Selection
    2. 6.2 Mode Selection
    3. 6.3 VDD Pin Supply Selection
  8. Test Procedure
    1. 7.1 Line/Load Regulation and Efficiency Measurement Procedure
    2. 7.2 Control Loop Gain and Phase Measurement Procedure
    3. 7.3 List of Test Points
    4. 7.4 Equipment Shutdown
  9. EVM Assembly Drawing and PCB Layout
  10. List of Materials
  11. 10Revision History

EVM Assembly Drawing and PCB Layout

The following figures (Figure 8-1 through Figure 8-8) show the design of the TPS53513EVM-PWR587 printed circuit board. The EVM has been designed using 4 Layers, 2-oz copper circuit board.

GUID-030DD926-5322-4E92-8CCC-077FD573BE13-low.gifFigure 8-1 TPS53513EVM-587 Top Layer Assembly Drawing
GUID-FB5A2675-F226-4812-9925-E0D193D6597B-low.gifFigure 8-2 TPS53513EVM-587 Bottom Assembly Drawing
GUID-531BCDF3-DA1D-4C6C-B5B1-349A9E88854E-low.gifFigure 8-3 TPS53513EVM-587 Top Copper
GUID-A2FAAF19-25F1-40C8-BCAE-2EEC43F50B44-low.gifFigure 8-4 TPS53513EVM-587 Layer 2 Copper
GUID-279E1482-AD2B-46EF-A429-B7F3D05DF05F-low.gifFigure 8-5 TPS53513EVM-587 Layer 3 Copper
GUID-DE4E8FCE-685D-44E7-A3A1-40D10558B659-low.gifFigure 8-6 TPS53513EVM-587 Layer 4 Copper
GUID-0D1CF0F7-7F55-4669-9C5D-6097D9126844-low.gifFigure 8-7 TPS53513EVM-587 Layer 5 Copper
GUID-AFB94347-589B-42BB-BECC-F95800966C6F-low.gifFigure 8-8 TPS53513EVM-587 Bottom Layer Copper