SLOS739A July   2012  – March 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - I/O Pin Characteristics
    6. 7.6  Master Clock Characteristics
    7. 7.7  Speaker Amplifier Characteristics
    8. 7.8  Headphone Amplifier and Line Driver Characteristics
    9. 7.9  Protection Characteristics
    10. 7.10 I2C Serial Control Port Requirements and Specifications
    11. 7.11 Serial Audio Port Timing
    12. 7.12 Typical Characteristics
      1. 7.12.1 Headphone Typical Characteristics
      2. 7.12.2 Line Driver Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power Supply
      2. 9.3.2  I2C Address Selection and Fault Output
      3. 9.3.3  Device Protection System
        1. 9.3.3.1 Overcurrent (OC) Protection With Current Limiting
        2. 9.3.3.2 Overtemperature Protection
        3. 9.3.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
      4. 9.3.4  Clock, Auto Detection, and PLL
      5. 9.3.5  PWM Section
      6. 9.3.6  SSTIMER Functionality
      7. 9.3.7  2.1-Mode Support
        1. 9.3.7.1 Supply Pumping and Polarity Inversion for 2.1 Mode
      8. 9.3.8  PBTL-Mode Support
      9. 9.3.9  I2C Serial Control Interface
        1. 9.3.9.1 Single- and Multiple-Byte Transfers
        2. 9.3.9.2 Single-Byte Write
        3. 9.3.9.3 Multiple-Byte Write
        4. 9.3.9.4 Single-Byte Read
        5. 9.3.9.5 Multiple-Byte Read
      10. 9.3.10 Dynamic Range Control (DRC)
      11. 9.3.11 Bank Switching
      12. 9.3.12 Serial Data Interface
        1. 9.3.12.1 Serial Interface Control and Timing
          1. 9.3.12.1.1 I2S Timing
          2. 9.3.12.1.2 Left-Justified
          3. 9.3.12.1.3 Right-Justified
      13. 9.3.13 DirectPath Headphone/Line Driver
        1. 9.3.13.1 Using Headphone Amplifier in TAS5721
        2. 9.3.13.2 Using Line Driver Amplifier in TAS5721
    4. 9.4 Device Functional Modes
      1. 9.4.1 Output Mode and MUX Selection
    5. 9.5 Programming
      1. 9.5.1 General I2C Operation
        1. 9.5.1.1 I2C Device Address Change Procedure
      2. 9.5.2 26-Bit 3.23 Number Format
    6. 9.6 Register Maps
      1. 9.6.1  Clock Control Register (0x00)
      2. 9.6.2  Device ID Register (0x01)
      3. 9.6.3  Error Status Register (0x02)
      4. 9.6.4  System Control Register 1 (0x03)
      5. 9.6.5  Serial Data Interface Register (0x04)
      6. 9.6.6  System Control Register 2 (0x05)
      7. 9.6.7  Soft Mute Register (0x06)
      8. 9.6.8  Volume Registers (0x07, 0x08, 0x09, 0x0A)
      9. 9.6.9  Volume Configuration Register (0x0E)
      10. 9.6.10 Modulation Limit Register (0x10)
      11. 9.6.11 Interchannel Delay Registers (0x11, 0x12, 0x13, and 0x14)
      12. 9.6.12 Pwm Shutdown Group Register (0x19)
      13. 9.6.13 Start/stop Period Register (0x1A)
      14. 9.6.14 Oscillator Trim Register (0x1B)
      15. 9.6.15 BKND_ERR Register (0x1C)
      16. 9.6.16 Input Multiplexer Register (0x20)
      17. 9.6.17 Channel 4 Source Select Register (0x21)
      18. 9.6.18 PWM Output MUX Register (0x25)
      19. 9.6.19 DRC Control (0x46)
      20. 9.6.20 Bank Switch and EQ Control (0x50)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Component Selection and Hardware Connections
        2. 10.2.2.2 I2C Pullup Resistors
        3. 10.2.2.3 Digital I/O Connectivity
        4. 10.2.2.4 Recommended Startup and Shutdown Procedures
          1. 10.2.2.4.1 Recommended Use Model
            1. 10.2.2.4.1.1 Initialization Sequence
            2. 10.2.2.4.1.2 Normal Operation
            3. 10.2.2.4.1.3 Shutdown Sequence
            4. 10.2.2.4.1.4 Power-Down Sequence
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
    1. 11.1 DVDD and AVDD Supplies
    2. 11.2 PVDD Power Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Development Support

For development support, see the following:

EVM product folder (http://www.ti.com/tool/tas5721evm)

13.2 Documentation Support

13.2.1 Related Documentation

For related documentation, see the following:

  • TAS5721EVM User’s Guide (SLOU346)
  • Class-D LC Filter Design Application Report (SLOA119)

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

DirectPath, E2E are trademarks of Texas Instruments.

I2C is a trademark of Philips Semiconductor Corp.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.