SFFS594 December 2023 TPSI3100-Q1
The failure mode distribution for the TPSI310x-Q1 and TPSI310x families in Table 4-2 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
VDDH/VDDM rails fail to power up. VDRV remains low. | 25% |
VDRV does not respond to EN signaling. | 15% |
Output power not meeting specification. Longer VDDH/VDDM start-up and recovery times. | 25% |
VDDH not regulated, potential device damage | 15% |
VDRV propagation times longer than specified | 5% |
Higher EMI | 5% |
Unpredictable power down sequence | 5% |
VDRV output held high | 5% |
The FMD in Die Failure Modes and Distribution excludes short circuit faults across the isolation barrier. Faults for short circuit across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.