ZHCSPX8B january   2000  – june 2023 XTR115 , XTR116

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reverse-Voltage Protection
      2. 7.3.2 Overvoltage Surge Protection
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Transistor
      2. 8.1.2 Minimum Scale Current
      3. 8.1.3 Offsetting the Input
      4. 8.1.4 Maximum Output Current
      5. 8.1.5 Radio Frequency Interference
      6. 8.1.6 Circuit Stability
  10. Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision A (November 2003) to Revision B (March 2022)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 添加了引脚功能ESD 等级热性能信息建议运行条件电气特性 表以及详细说明概述功能方框图特性说明应用和实施器件和文档支持机械、封装和可订购信息 部分Go
  • Added Pin Functions tableGo
  • Changed operating temperature minimum value from –55°C to –40°C in Absolute Maximum Ratings Go
  • Deleted thermal resistance, θJA specification of 150 °C/W from Electrical Characteristics; added a Thermal Information table, with RθJA = 128.2 °C/W and other detailed thermal parameters.Go
  • Changed span error test condition from: IIN = 250 µA to 25 mA to: IOUT = 250 µA to 25 mA in Electrical Characteristics Go
  • Changed VREF voltage accuracy vs load typical value from ±100 ppm/mA to ±200 ppm/mA in Electrical Characteristics Go
  • Changed bias current vs temperature typical value from 150 pA/°C to 300 pA/°C in Electrical Characteristics Go
  • Changed Basic Circuit Connections application diagramGo
  • Changed External Transistor applications information section to incorporate additional guidance regarding transistor power dissipation and thermal concernsGo
  • Added Circuit Stability application information sectionGo