ZHCSIF6D
March 2008 – November 2023
UCC27324-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Overall Electrical Characteristics
5.6
Power Dissipation Characteristics
5.7
Input (INA, INB) Electrical Characteristics
5.8
Output (OUTA, OUTB) Electrical Characteristics
5.9
Switching Characteristics
5.10
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Input Stage
6.3.2
Output Stage
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.1.1
Parallel Outputs
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
Propagation Delay
7.2.2.2
Source and Sink Capabilities During Miller Plateau
7.2.2.3
Supply Voltage (VDD)
7.2.2.4
Drive Current and Power Requirements
7.2.3
Application Curve
8
Power Supply Recommendations
9
Layout
9.1
Layout Guidelines
9.2
Layout Example
9.3
Thermal Considerations
10
Device and Documentation Support
10.1
第三方产品免责声明
10.2
Documentation Support
10.2.1
Related Documentation
10.3
接收文档更新通知
10.4
支持资源
10.5
Trademarks
10.6
静电放电警告
10.7
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsif6d_oa
zhcsif6d_pm
10.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。