ZHCSFL6E July   2016  – November 2023 TUSB522P

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics, Power Supply
    6. 6.6 Electrical Characteristics, DC
    7. 6.7 Electrical Characteristics, AC
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Equalization
      2. 7.3.2 De-Emphasis Control and Output Swing
      3. 7.3.3 Automatic LFPS Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration
      2. 7.4.2 Power Modes
        1. 7.4.2.1 U0 Mode (Active Power Mode)
        2. 7.4.2.2 U2/U3 (Low Power Mode)
        3. 7.4.2.3 Disconnect Mode - RX Detect
        4. 7.4.2.4 Shutdown Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TUSB522PUNIT
RGE (VQFN)
24 PINS
RθJAJunction-to-ambient thermal resistance51.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance55.9°C/W
RθJBJunction-to-board thermal resistance28.3°C/W
ψJTJunction-to-top characterization parameter2.0°C/W
ψJBJunction-to-board characterization parameter28.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.7°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.