ZHCSFA8 May   2016 TUSB501-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Supply Characteristics
    6. 7.6 DC Electrical Characteristics
    7. 7.7 AC Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Receiver Equalization
      2. 9.3.2 De-Emphasis Control and Output Swing
      3. 9.3.3 Automatic LFPS Detection
      4. 9.3.4 Automatic Power Management
    4. 9.4 Device Functional Modes
      1. 9.4.1 Disconnect Mode
      2. 9.4.2 U Modes
        1. 9.4.2.1 U0 Mode
        2. 9.4.2.2 U2/U3 Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 社区资源
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage range (2) VCC –0.5 4 V
Voltage range at any input or output terminal Differential I/O –0.5 4 V
CMOS inputs –0.5 VCC + 0.5 V
Storage temperature, TSTG –65 150 °C
Maximum junction temperature, TJ -40 125 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminals.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±5000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Main power supply 3 3.3 3.6 V
TA Operating free-air temperature –40 105 °C
CAC AC coupling capacitor 75 100 200 nF

7.4 Thermal Information

THERMAL METRIC(1) TUSB501-Q1 UNITS
DRF (WSON)
RθJA Junction-to-ambient thermal resistance 105.5 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 47.5 °C/W
RθJB Junction-to-board thermal resistance 70.9 °C/W
ψJT Junction-to-top characterization parameter 10.0 °C/W
ψJB Junction-to-board characterization parameter 70.9 °C/W
RθJC(bottom) Junction-to-case(bottom) thermal resistance 51.8 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Power Supply Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX(2) UNIT
ICC-ACTIVE Average active current Link in U0 with SuperSpeed USB data transmission, OS = Low 38.1 mA
Link in U0 with SuperSpeed USB data transmission, OS = High 43.8 65
ICC-IDLE Average current in idle state Link has some activity, not in U0, OS = Low 29.8 mA
ICC-U2U3 Average current in U2/U3 Link in U2 or U3 6.1 mA
ICC-NC Average current with no connection No SuperSpeed USB device is connected to TXP, TXN 1.3 mA
PD Power Dissipation in U0 OS = Low 126 mW
OS = High 145 234
(1) TYP values use VCC = 3.3 V, TA = 25°C.
(2) MAX values use VCC = 3.6 V, TA = –40°C.

7.6 DC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
3-State CMOS Inputs (EQ, DE)
VIH High-level input voltage 2.8 V
VIM Mid-level input voltage VCC / 2 V
VIL Low-level input voltage 0.6 V
VF Floating voltage VIN = High impedance VCC / 2 V
RPU Internal pull-up resistance 190 kΩ
RPD Internal pull-down resistance 190 kΩ
IIH High-level input current VIN = 3.6 V 36 µA
IIL Low-level input current VIN = GND, VCC = 3.6 V -36 µA
2-State CMOS Input (OS)
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.5 V
VF Floating voltage VIN = High impedance GND V
RPD Internal pull-down resistance 270 kΩ
IIH High-level input current VIN = 3.6 V 26 µA
IIL Low-level input current VIN = GND -1 µA

7.7 AC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Differential Receiver (RXP, RXN)
VDIFF-pp Input differential voltage swing AC-coupled differential peak-to-peak signal 100 1200 mVpp
VCM-RX Common-mode voltage bias in the receiver (DC) 3.3 V
ZRX-DIFF Differential input impedance (DC) Present after a SuperSpeed USB device is detected on TXP/TXN 72 91 120 Ω
ZRX-CM Common-mode input impedance (DC) Present after a SuperSpeed USB device is detected on TXP, TXN 18 22.8 30 Ω
ZRX-HIGH-IMP-DC-POS Common-mode input impedance with termination disabled (DC) Present when no SuperSpeed USB device is detected on TXP, TXN. Measured over the range of 0-500 mV with respect to GND. 25 35 kΩ
VRX-LFPS-DET-DIFF-pp Low Frequency Periodic Signaling (LFPS) Detect Threshold Below the minimum is squelched 100 300 mVpp
Differential Transmitter (TXP, TXN)
VTX-DIFF-PP Transmitter differential voltage swing (transition-bit) OS = Low, No load 930 mVpp
OS = High, No load 1300
VTX-DE-RATIO Transmitter de-emphasis DE = Floating, OS = Low -3.5 dB
CTX TX input capacitance to GND At 2.5 GHz 1.25 pF
ZTX-DIFF Differential impedance of the driver 75 93 125 Ω
ZTX-CM Common-mode impedance of the driver Measured with respect to AC ground over 0-500 mV 18.75 31.25 Ω
ITX-SC TX short circuit current TX ± shorted to GND 60 mA
VCM-TX Common-mode voltage bias in the transmitter (DC) 1.2 2.5 V
VCM-TX-AC AC common-mode voltage swing in active mode Within U0 and within LFPS 100 mVpp
VTX-IDLE-DIFF -AC-pp Differential voltage swing during electrical idle Tested with a high-pass filter 0 10 mVpp
VTX-CM-DeltaU1-U0 Absolute delta of DC CM voltage during active and idle states Restrict the test condition to meet 100 mV 100 mV
VTX-idle-diff-DC DC electrical idle differential output voltage Voltage must be low pass filtered to remove any AC component 0 12 mV
Differential Transmitter (TXP, TXN)
tR, tF Output rise, fall time
see Figure 6 		20%-80% of differential voltage measured 1 inch from the output pin 80 ps
tRF-MM Output Rise, Fall time mismatch 20%-80% of differential voltage measured 1 inch from the output pin 20 ps
tdiff-LH,
tdiff-HL 		Differential propagation delay
see Figure 4 		De-emphasis = -3.5 dB propagation delay between 50% level at input and output 290 ps
tidleEntry, tidleExit Idle entry and exit times
see Figure 5 		3.6 ns
Timing
tREADY Time from power applied until RX termination Apply 0 V to VCC, connect SuperSpeed USB termination to TX±, apply 3.3 V to VCC, and measure when ZRX-DIFF is enabled. 9 ms
Jitter
TJTX-EYE Total jitter (1) (2) EQ = Floating, OS = High,
DE = High
See Figure 3.		 0.213 UI (4)
DJTX Deterministic jitter (2) 0.197 UI (4)
RJTX Random jitter (2) (3) 0.016 UI (4)
(1) Includes RJ at 10-12.
(2) Measured at the ends of reference channel in Figure 3 with K28.5 pattern, VID = 1000 mVpp, 5 Gbps, -3.5 dB de-emphasis from source.
(3) Rj calculated as 14.069 times the RMS random jitter for 10-12 BER.
(4) UI = 200 ps.

7.8 Typical Characteristics

TUSB501-Q1 TUSB501_INPUT_JITTER_RX_PINS.png
TA = 25°C
Figure 1. Input for Typical Output Measurement
at TUSB501-Q1
TUSB501-Q1 TJDJ_TUSB501_UNIT_4.png
TA = 25°C DE = HIGH OS = HIGH
EQ = NC
Figure 2. Typical Output Eye for Jitter Measurement Setup in Figure 3