ZHCSHL5C February   2018  – September 2019 TS3USBCA4

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (3 V ≤ VCC ≤ 3.6 V)
    6. 6.6  Electrical Characteristics (2.4 V ≤ VCC ≤ 5.5 V)
    7. 6.7  Switching Characteristics (2.4 V ≤ VCC ≤ 5.5 V)
    8. 6.8  Timing Requirements (3 V ≤ VCC ≤ 3.6 V)
    9. 6.9  Timing Requirements (2.4 V ≤ VCC ≤ 5.5 V)
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Audio Path
      2. 8.3.2 High-Speed Paths
      3. 8.3.3 3-level Input
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 TS3USBCA4 Registers
        1. 8.6.1.1 Revision_ID Register (Offset = 9h) [reset = 0h]
          1. Table 8. Revision_ID Register Field Descriptions
        2. 8.6.1.2 General_1 Register (Offset = Ah) [reset = 0h]
          1. Table 9. General_1 Register Field Descriptions
        3. 8.6.1.3 General_2 Register (Offset = Bh) [reset = 0h]
          1. Table 10. General_2 Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.9 Timing Requirements (2.4 V ≤ VCC ≤ 5.5 V)

All minimum/maximum specifications are at TA = -40/85°C, VCC = 2.4 V/5.5 V, unless otherwise noted. Typical specifications are at TA = 25°C, VCC = 3.3 V, unless otherwise noted.
TEST CONDITIONS MIN NOM MAX UNIT
tON_MICGND Switch ON time for MIC/AGND path VPU=1.8V, RPU=2100Ω, CL=50pF 12 µs
tOFF_MICGND Switch OFF time for MIC/AGND path VPU=1.8V, RPU=2100Ω, CL=50pF 6 µs
tON_HS Switch ON time for high-speed path RS=50Ω, RL =50Ω 1.2 µs
tOFF_HS Switch OFF time for high-speed path RS=50Ω, RL =50Ω 780 ns
tBBM Break before make off time for MIC/AGND path VPU=1.8V, RPU=2100Ω, RL=50Ω, CL=50pF 1300 ns
tFLIP Response time for the FLIP pin RS=50Ω, RL=50Ω 1.1 µs
tDEV_ENABLE Device enable time from OEn = L to device ready OEn=L 450 µs
tDEV_DISABLE Device disable time from OEn = H to device shutdown OEn=H 200 ns
tD_PG VCC (MIN) to Internal Power Good asserted high (Refer to Figure 1) OEn=L 250 µs
tCFG_DB Debounce time for SEL[1:0] and I2C_EN configuration pins (Refer to Figure 1) OEn=L 140 ns
tVCC_RAMP VCC power supply (0 – 100%) ramp time requirement (Refer to Figure 1) 0.1 100 ms