ZHCSAQ2B January   2013  – April 2017 TS3A5223

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Logic Translation
      2. 8.3.2 Break-Before-Make
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Parameter Measurement Information

TS3A5223 Ron_meas.gif Figure 7. ON-State Resistance (RON)
TS3A5223 ton_toff.gif Figure 8. Turn-On (tON) and Turn-Off Time (tOFF)
TS3A5223 tbbm.gif Figure 9. Break-Before-Make Time (tBBM)
TS3A5223 THD.gif Figure 10. TOTAL HARMONIC DISTORTION (THD)
TS3A5223 Xtalk.gif Figure 11. Crosstalk (XTALK)
TS3A5223 o_iso.gif Figure 12. OFF Isolation (OISO)