ZHCSIY2B July   2018  – August 2021 TPS65988

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Requirements and Characteristics
    6. 6.6  Power Consumption Characteristics
    7. 6.7  Power Switch Characteristics
    8. 6.8  Cable Detection Characteristics
    9. 6.9  USB-PD Baseband Signal Requirements and Characteristics
    10. 6.10 BC1.2 Characteristics
    11. 6.11 Thermal Shutdown Characteristics
    12. 6.12 Oscillator Characteristics
    13. 6.13 I/O Characteristics
    14. 6.14 PWM Driver Characteristics
    15. 6.15 I2C Requirements and Characteristics
    16. 6.16 SPI Controller Timing Requirements
    17. 6.17 HPD Timing Requirements
    18. 6.18 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
        1. 8.3.1.1 USB-PD Encoding and Signaling
        2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.1.4 USB-PD BMC Transmitter
        5. 8.3.1.5 USB-PD BMC Receiver
      2. 8.3.2  Power Management
        1. 8.3.2.1 Power-On And Supervisory Functions
        2. 8.3.2.2 VBUS LDO
        3. 8.3.2.3 Supply Switch Over
      3. 8.3.3  Port Power Switches
        1. 8.3.3.1 PP_HV Power Switch
          1. 8.3.3.1.1 PP_HV Over Current Clamp
          2. 8.3.3.1.2 PP_HV Over Current Protection
          3. 8.3.3.1.3 PP_HV OVP and UVP
          4. 8.3.3.1.4 PP_HV Reverse Current Protection
        2. 8.3.3.2 Schottky for Current Surge Protection
        3. 8.3.3.3 PP_EXT Power Path Control
        4. 8.3.3.4 PP_CABLE Power Switch
          1. 8.3.3.4.1 PP_CABLE Over Current Protection
          2. 8.3.3.4.2 PP_CABLE Input Good Monitor
        5. 8.3.3.5 VBUS Transition to VSAFE5V
        6. 8.3.3.6 VBUS Transition to VSAFE0V
      4. 8.3.4  Cable Plug and Orientation Detection
        1. 8.3.4.1 Configured as a DFP
        2. 8.3.4.2 Configured as a UFP
        3. 8.3.4.3 Configured as a DRP
        4. 8.3.4.4 Fast Role Swap Signaling
      5. 8.3.5  Dead Battery Operation
        1. 8.3.5.1 Dead Battery Advertisement
        2. 8.3.5.2 BUSPOWER (ADCIN1)
      6. 8.3.6  Battery Charger Detection and Advertisement
        1. 8.3.6.1 BC1.2 Data Contact Detect
        2. 8.3.6.2 BC1.2 Primary and Secondary Detection
        3. 8.3.6.3 Charging Downstream Port Advertisement
        4. 8.3.6.4 Dedicated Charging Port Advertisement
        5. 8.3.6.5 2.7V Divider3 Mode Advertisement
        6. 8.3.6.6 1.2V Mode Advertisement
        7. 8.3.6.7 DCP Auto Mode Advertisement
      7. 8.3.7  ADC
      8. 8.3.8  DisplayPort HPD
      9. 8.3.9  Digital Interfaces
        1. 8.3.9.1 General GPIO
        2. 8.3.9.2 I2C
        3. 8.3.9.3 SPI
      10. 8.3.10 PWM Driver
      11. 8.3.11 Digital Core
      12. 8.3.12 I2C Interfaces
        1. 8.3.12.1 I2C Interface Description
        2. 8.3.12.2 I2C Clock Stretching
        3. 8.3.12.3 I2C Address Setting
        4. 8.3.12.4 Unique Address Interface
        5. 8.3.12.5 I2C Pin Address Setting (ADCIN2)
      13. 8.3.13 SPI Controller Interface
      14. 8.3.14 Thermal Shutdown
      15. 8.3.15 Oscillators
    4. 8.4 Device Functional Modes
      1. 8.4.1 Boot
      2. 8.4.2 Power States
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Type-C VBUS Design Considerations
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 External Sink Power Path Options
            1. 9.2.1.2.1.1 Load Switch Power Path
            2. 9.2.1.2.1.2 Discrete Power Path
          2. 9.2.1.2.2 Type-C Connector VBUS Capacitors
          3. 9.2.1.2.3 VBUS Schottky and TVS Diodes
          4. 9.2.1.2.4 VBUS Snubber Circuit
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual Port Thunderbolt Notebook with AR Supporting USB PD Charging
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 USB Power Delivery Source Capabilities
        3. 9.2.2.3 USB Power Delivery Sink Capabilities
        4. 9.2.2.4 Supported Data Modes
        5. 9.2.2.5 RESETN
        6. 9.2.2.6 I2C Design Requirements
        7. 9.2.2.7 TS3DS10224 SBU Mux for AUX and LSTX/RX
        8. 9.2.2.8 Thunderbolt Flash Options
      3. 9.2.3 Dual Port USB & Displayport Notebook Supporting PD Charging
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 USB Power Delivery Source Capabilities
        3. 9.2.3.3 USB Power Delivery Sink Capabilities
        4. 9.2.3.4 Supported Data Modes
        5. 9.2.3.5 TUSB1044 Re-Driver GPIO Control
      4. 9.2.4 USB Type-C & PD Monitor/Dock
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
          1. 9.2.4.2.1 USB Power Delivery Source Capabilities
          2. 9.2.4.2.2 USB and DisplayPort Supported Data Modes
          3. 9.2.4.2.3 TUSB1064 Super Speed Mux GPIO Control
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 VIN_3V3 Input Switch
      2. 10.1.2 VBUS 3.3-V LDO
    2. 10.2 1.8-V Power
    3. 10.3 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1  Layout Guidelines
    2. 11.2  Layout Example
    3. 11.3  Stack-Up and Design Rules
    4. 11.4  Main Component Placement
    5. 11.5  1.4 Super Speed Type-C Connectors
    6. 11.6  Capacitor Placement
    7. 11.7  CC1/2 Capacitors & ADCIN1/2 Resistors
    8. 11.8  CC & SBU Protection Placement
    9. 11.9  CC Routing
    10. 11.10 DRAIN1 and DRAIN2 Pad Pours
    11. 11.11 USB2 Routing for ESD Protection and BC1.2
    12. 11.12 VBUS Routing
    13. 11.13 Completed Layout
    14. 11.14 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
      2. 12.1.2 Firmware Warranty Disclaimer
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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10.3 Recommended Supply Load Capacitance

Table 10-1 lists the recommended board capacitances for the various supplies. The typical capacitance is the nominally rated capacitance that must be placed on the board as close to the pin as possible. The maximum capacitance must not be exceeded on pins for which it is specified. The minimum capacitance is minimum capacitance allowing for tolerances and voltage derating ensuring proper operation.

Table 10-1 Recommended Supply Load Capacitance
PARAMETERDESCRIPTIONVOLTAGE RATINGCAPACITANCE
MIN
(ABSOLUTE)		TYP
(PLACED)		MAX
(ABSOLUTE)
CVIN_3V3Capacitance on VIN_3V36.3 V5 µF10 μF
CLDO_3V3Capacitance on LDO_3V36.3 V5 µF10 µF25 µF
CLDO_1V8Capacitance on LDO_1V84 V2.2 µF4.7 µF12 µF
CVBUS1Capacitance on VBUS125 V0.5 µF1 µF12 µF
CVBUS2Capacitance on VBUS225 V0.5 µF1 µF12 µF
CPP_HV_SRCCapacitance on PP_HV when configured as a 5V source10 V2.5 µF4.7 µF
CPP_HV_SNKCapacitance on PP_HV when configured as a 20V sink25 V1 µF47 µF120 µF
CPP_CABLECapacitance on PP_CABLE. When shorted to PP_HV configured as a 5V source, the CPP_HV_SRC capacitance may be shared.10 V2.5 µF4.7 µF