ZHCSJG8I July   2010  – October 2019 TPS63020 , TPS63021

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      效率与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamic Voltage Positioning
      2. 7.3.2 Dynamic Current Limit
      3. 7.3.3 Device Enable
      4. 7.3.4 Power Good
      5. 7.3.5 Overvoltage Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-start and Short Circuit Protection
      2. 7.4.2 Buck-Boost Operation
      3. 7.4.3 Control Loop
      4. 7.4.4 Power Save Mode and Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bypass Capacitor
      3. 8.2.3 Setting The Output Voltage
      4. 8.2.4 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Improved Transient Response for 2 A Load Current
      2. 8.3.2 Supercapacitor Backup Power Supply With Active Cell Balancing
      3. 8.3.3 Low-Power TEC Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 器件支持
      1. 11.2.1 使用 WEBENCH 工具创建定制设计方案
      2. 11.2.2 第三方产品免责声明
    3. 11.3 文档支持
      1. 11.3.1 相关文档
    4. 11.4 相关链接
    5. 11.5 支持资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from H Revision (August 2019) to I Revision

  • Changed ESD numbers to reflect latest test insightsGo
  • Changed Footnotes in order to reflect wording of latest JEP155 and JEP157 specificationsGo
  • Changed VFB naming and description for better readabilityGo

Changes from G Revision (March 2019) to H Revision

Changes from F Revision (March 2019) to G Revision

  • 更改了“简化原理图”，删除了从 VINA 到 VIN 的连接Go
  • Changed Figure 7, removed the connection from VINA to VIN Go
  • Changed Figure 28, removed the connection from VINA to VIN Go

Changes from E Revision (May 2017) to F Revision

  • 更新了 特性 和 应用 （第 1 页）Go
  • 将器件信息表中的“封装尺寸”列改为“输出电压”Go
  • Changed the Pin Configuration image Go
  • Changed Chapter order in Application Information .Go
  • Updated output capacitor selection section Go
  • Added Table of Typical Characteristics Curves. Go
  • Changed Figure 24 and Figure 25Go
  • Added Figure 26 and Figure 27Go
  • Changed Figure 28Go
  • Added system examples Supercapacitor Backup Power Supply With Active Cell Balancing and Low-Power TEC DriverGo

Changes from D Revision (October 2015) to E Revision

Changes from C Revision (February 2013) to D Revision

  • Added 添加了处理额定值 表、特性 说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go

Changes from B Revision (August 2012) to C Revision

  • Changed Figure 7 schematic to show correct component values. Go
  • Changed Figure 28 schematic to show correct component values. Go

Changes from A Revision (December 2011) to B Revision

  • Changed the Duty cycle in step down conversion values, added MIN = 20%, deleted TYP = 30% and MAX = 40%Go

Changes from * Revision (April 2010) to A Revision