ZHCSJG8I July   2010  – October 2019 TPS63020 , TPS63021

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      效率与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Dynamic Voltage Positioning
      2. 7.3.2 Dynamic Current Limit
      3. 7.3.3 Device Enable
      4. 7.3.4 Power Good
      5. 7.3.5 Overvoltage Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-start and Short Circuit Protection
      2. 7.4.2 Buck-Boost Operation
      3. 7.4.3 Control Loop
      4. 7.4.4 Power Save Mode and Synchronization
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bypass Capacitor
      3. 8.2.3 Setting The Output Voltage
      4. 8.2.4 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Improved Transient Response for 2 A Load Current
      2. 8.3.2 Supercapacitor Backup Power Supply With Active Cell Balancing
      3. 8.3.3 Low-Power TEC Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 器件支持
      1. 11.2.1 使用 WEBENCH 工具创建定制设计方案
      2. 11.2.2 第三方产品免责声明
    3. 11.3 文档支持
      1. 11.3.1 相关文档
    4. 11.4 相关链接
    5. 11.5 支持资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Layout Guidelines

For all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator can show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. Place the input capacitor, output capacitor, and the inductor as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.

The feedback divider must be placed as close as possible to the control ground pin of the IC. To lay out the control ground, short traces are recommended as well, separation from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.