ZHCS124C MARCH   2011  – January 2015 TPS56221

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Reference
      2. 7.3.2  Enable Functionality, Start-Up, Sequence, and Timing
        1. 7.3.2.1 COMP Pin Impedance Sensing
        2. 7.3.2.2 Overcurrent Protection (OCP) Setting
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Oscillator
      5. 7.3.5  Overcurrent Protection (OCP)
      6. 7.3.6  Switching Node (SW)
      7. 7.3.7  Input Undervoltage Lockout (UVLO)
      8. 7.3.8  Prebias Start-Up
      9. 7.3.9  Power Good
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency Selection
        2. 8.2.2.2  Inductor Selection
        3. 8.2.2.3  Output Capacitor Selection
        4. 8.2.2.4  Inductor Peak Current Rating
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Boot-Strap Capacitor (C14)
        7. 8.2.2.7  Boot-Strap Resistor (R2)
          1. 8.2.2.7.1 RC Snubber (R9 and C18)
        8. 8.2.2.8  VDD Bypass Capacitor (C11)
        9. 8.2.2.9  BP5 Bypass Capacitor (C12)
        10. 8.2.2.10 Soft-Start Capacitor (C13)
        11. 8.2.2.11 Current Limit (R1)
        12. 8.2.2.12 Feedback Divider (R4, R7)
        13. 8.2.2.13 Compensation (C15, C16, C17, R3, R6)
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQP|22
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS56221 is highly integrated synchronous step-down DC-DC converters. The device is used to convert a higher DC input voltage (4.5 V to 14 V recommended) to a lower DC output voltage (as low as 0.6 V), with a maximum output current of 25 A, for a variety of applications. Use the following design procedure to select key component values for this device.

8.2 Typical Application

This design example describes a 25-A, 12-V to 1.0-V design using the TPS56221 high-current integrated buck converter. The system specifications are listed in Table 1.

TPS56221 v11045_lusah5.gifFigure 20. Typical Application Schematic
TPS56221 des_ex_app_lusah5.gifFigure 21. Design Example Schematic

8.2.1 Design Requirements

Table 1. Design Example Parameters

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 8.0 14 V
VIN(ripple) Input ripple IOUT = 25 A 0.2 V
VOUT Output voltage 0 A ≤ IOUT ≤ 25 A 0.98 1.00 1.02 V
Line regulation 8 V ≤ VIN ≤ 14 V 0.1%
Load regulation 0 A ≤ IOUT ≤ 25 A 1.0%
VP-P Output ripple IOUT= 25 A 20 mV
VOVER Output overshoot ITRAN = 10 A 100 mV
VUNDER Output undershoot ITRAN = 10 A 100 mV
IOUT Output current 8 V ≤ VIN ≤ 14 V 0 25 A
tSS Softstart time VIN = 12 V 2.0 ms
ISCP Short circuit current trip point 32 A
η Efficiency VIN = 12 V, IOUT = 25 A 87%
fSW Switching frequency 500 kHz

8.2.2 Detailed Design Procedure

Table 2. List of Materials for TPS56221 Design Example

REFERENCE
DESiGNATOR		 QTY VALUE DESCRIPTION SIZE PART NUMBER MANUFACTURER
C1, C2, C3, C4 4 22 µF Capacitor, Ceramic, 25 V, X5R, 20% 1210 Std Std
C5, C11 2 1.0 µF Capacitor, Ceramic, 25 V, X7R, 20% 0805 Std Std
C6 0 100 µF Capacitor, Ceramic, 16 Vdc, ±20% Code D8 Std EEEFP1C101AP
C7, C8, C9, C10, C19 5 100 µF Capacitor, Ceramic, 6.3 V, X5R, 20% 1210 Std Std
C12 1 4.7 µF Capacitor, Ceramic, 10 V, X5R, 20% 0805 Std Std
C13 1 33 nF Capacitor, Ceramic, 16 V, X7R, 20% 0603 Std Std
C14 1 100 nF Capacitor, Ceramic, 16V, X7R, 20% 0402 Std Std
C15, C18 2 2200 pF Capacitor, Ceramic, 50 V, X7R, 10% 0603 Std Std
C16 1 100 pF Capacitor, Ceramic, 50 V, C0G, 10% 0603 Std Std
C17 1 680 pF Capacitor, Ceramic, 50 V, C0G, 10% 0603 Std Std
C20, C21 0 100 µF Capacitor, Ceramic, 6.3 V, X5R, 20% 1210 Std Std
J1, J2 2 Terminal Block, 4-pin, 15-A, 5.1 mm 0.80 x 0.35 inch ED120/4DS
J3 1 Header, Male 2-pin, 100 mil spacing 0.100 inch x 2 PEC02SAAN
L1 1 320 nH Inductor, 320 nH, 41 A, 0.32 mΩ 0.530 x 0.510 inch PA2202-321NL Pulse
R1 1 1.78 kΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
R2 1 5.10 Ω Resistor, Chip, 1/16W, 1% 0603 Std Std
R3 1 7.87 kΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
R4 1 20.5 kΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
R5 49.9Ω Resistor, Chip, 1/16W, 1% 0603
R6 1 1.00 kΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
R7 1 30.1 kΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
R8 1 0 Ω Resistor, Chip, 1/16W, 1% 0603
R9 1 1 Ω Resistor, Chip, 1/16W, 1% 0603
R10 1 100 kΩ Resistor, Chip, 1/16W, 1% 0603
TP1, TP3, TP11 3 Test Point, Red, Thru Hole 0.125 x 0.125 inch 5010
TP2, TP4, TP8, TP9, TP12 5 Test Point, Black, Thru Hole 0.125 x 0.125 inch 5011
TP5, TP6 2 Test Point, Yellow, Thru Hole 0.125 x 0.125 inch 5014
TP7, TP10 2 Test Point, White, Thru Hole 0.125 x 0.125 inch 5012
U1 1 QFN-22 4.5-V to 14-V Input, 25-A, synchronous buck converter 6 × 5 mm TPS56221DQP TI

8.2.2.1 Switching Frequency Selection

To achieve a balance between small size and high efficiency for this design, use switching frequency of 500 kHz.

8.2.2.2 Inductor Selection

Synchronous buck power inductors are typically sized for between approximately 20% and 40% peak-to-peak ripple current (IP-P).

Using this target ripple current, the required inductor size can be calculated as shown in Equation 3.

Equation 3. TPS56221 deq_l_lusah5.gif

Selecting a standard 320-nH inductor value, IP-P = 5.8 A.

The RMS current through the inductor is approximated in Equation 4.

Equation 4. TPS56221 deq_irms_lusah5.gif

8.2.2.3 Output Capacitor Selection

The selection of the output capacitor is typically driven by the output transient response. For applications with VIN(min) > 2 x VOUT, use overshoot to calculate the minimum output capacitance and the equation is shown in Equation 5.

Equation 5. TPS56221 deq_coutmin_lusah5.gif

For applications where VIN(min) < 2 × VOUT, use undershoot to calculate minimum output capacitance. The equation is shown in Equation 6.

Equation 6. TPS56221 deq_coutminunder_lusah5.gif

To meet the low ESR and high-capacitance requirements of this design, five 100-µF, 1210 ceramic capacitors are selected. With a minimum capacitance, the maximum allowable ESR is determined by the maximum ripple voltage and is approximated by Equation 7.

Equation 7. TPS56221 deq_esr_coutmax_lusah5.gif

8.2.2.4 Inductor Peak Current Rating

With output capacitance, it is possible to calculate the charge current during start-up and determine the minimum saturation current rating for the inductor. The start-up charging current is approximated by Equation 8.

Equation 8. TPS56221 deq_icharge_lusah5.gif

The peak current in the inductor IL(peak) is approximated by Equation 9.

Equation 9. TPS56221 deq_ilpeak_lusah5.gif

With the short circuit current trip point IOUT(max) set at 32 A, the maximum allowable peak current IL(peak max) is

Equation 10. TPS56221 deq_ilpeakmax_lusah5.gif

The selection of output capacitor meets the maximum allowable peak current requirement.

Table 3. Inductor Requirements Summary

PARAMETER VALUE UNIT
L Inductance 320 nH
IL(rms) RMS current (thermal rating) 25.1 A
IL(peak max) Peak current (saturation rating) 32.9 A

The PA0513.321NLT, 320-nH, 0.32-mΩ, 41-A inductor is selected.

8.2.2.5 Input Capacitor Selection

The input voltage ripple is divided between capacitance and ESR. For this design VIN_RIPPLE(CAP) = 150 mV and VIN_RIPPLE(ESR) = 50 mV. The minimum capacitance and maximum ESR are estimated in Equation 11.

Equation 11. TPS56221 deq_cinmin_lusah5.gif
Equation 12. TPS56221 deq_esrcinmax_lusah5.gif

The RMS current in the input capacitors is estimated by Equation 13.

Equation 13. TPS56221 deq_irmscin_lusah5.gif

Four 1210, 22-µF, 25-V, X5R ceramic capacitors with about 2.5-mΩ of ESR and a 2.5-A RMS current rating are selected. Higher voltage capacitors are selected to minimize capacitance loss at the DC bias voltage to ensure the capacitors will have sufficient capacitance at the working voltage while a 1.0-µF capacitor in smaller case size is used to reduce high frequency noise from the MOSFET switching.

8.2.2.6 Boot-Strap Capacitor (C14)

The bootstrap capacitor maintains power to the high-side driver during the high-side switch ON time. Per the requirements of the integrated MOSFET, CBOOT is 100 nF with a minimum 10-V rating.

8.2.2.7 Boot-Strap Resistor (R2)

The bootstrap resistor slows the rising edge of the SW voltage to reduce ringing and improve EMI. Per the datasheet recommendation a 5.10-Ω resistor is selected.

8.2.2.7.1 RC Snubber (R9 and C18)

To effectively limit the switch node ringing, a 1.0-Ω resistor and a 2200-pF capacitor are selected.

8.2.2.8 VDD Bypass Capacitor (C11)

In accordance with pin terminations recommended in the data sheet, VDD is bypassed to GND with a 1.0-µF capacitor.

8.2.2.9 BP5 Bypass Capacitor (C12)

Per the datasheet recommended pin terminations, BP5 is bypassed to GND with at least 1.0-µF capacitor. For additional filtering and noise immunity a 4.7-µF capacitor is selected.

8.2.2.10 Soft-Start Capacitor (C13)

The soft-start capacitor provides a constant ramp voltage to the error amplifier to provide controlled, smooth start-up. The soft-start capacitor is sized using Equation 14.

Equation 14. TPS56221 deq_css_lusah5.gif

8.2.2.11 Current Limit (R1)

The TPS56221 uses the negative drop across the internal low-side FET at the end of the OFF-time to measure the valley of the inductor current. Allowing for a minimum of 30% over maximum load, the programming resistor is selected using Equation 15.

Equation 15. TPS56221 deq_rocset_lusah5.gif

A standard 2.87-kΩ resistor is selected from the E-48 series.

8.2.2.12 Feedback Divider (R4, R7)

The TPS56221 converter uses a full operational amplifier with an internally fixed 0.600-V reference. R4 is selected between 10 kΩ and 50 kΩ for a balance of feedback current and noise immunity. With R4 set to 20.5 kΩ, The output voltage is programmed with a resistor divider given by Equation 16.

Equation 16. TPS56221 deq_7_lusah5.gif

A standard 30.1-kΩ resistor is selected from the E-48 series.

8.2.2.13 Compensation (C15, C16, C17, R3, R6)

Using the TPS40k Loop Stability Tool for 50 kHz of bandwidth and 60 degrees of phase margin with an R4 value of 20.5 kΩ, the following values are obtained.

  • C17 = C_1 = 680 pF
  • C15 = C_2 = 2200 pF
  • C16 = C_3 = 100 pF
  • R6 = R_2 = 1.00 kΩ
  • R3 = R_3 = 7.87 kΩ

8.2.3 Application Curves

Output voltage 12 V to 1.0 V, input current 0 A to 25 A.
TPS56221 de_iout_v_eff_lusah5.pngFigure 22. Efficiency vs Load Current
TPS56221 deg_ripple_lusah5.gifFigure 24. TPS56221 Design Example Output Ripple 20 mV/div, 1.0 µs/div, 20 MHz Bandwidth, AC Coupled
TPS56221 loop_response_lusah5.pngFigure 23. Loop Response 51 kHz Bandwidth, 48° Phase Margin