ZHCSB47B May   2013  – March 2017 TPS54540

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Pulse Skip Eco-mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Internal Soft-Start
      9. 7.3.9  Constant Switching Frequency and Timing Resistor (RT/CLK) Terminal)
      10. 7.3.10 Accurate Current Limit Operation and Maximum Switching Frequency
      11. 7.3.11 Synchronization to RT/CLK Terminal
      12. 7.3.12 Overvoltage Protection
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Small Signal Model for Loop Response
      15. 7.3.15 Simple Small Signal Model for Peak Current Mode Control
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN = < 4.5 V (Minimum VIN)
      2. 7.4.2 Operation with EN Control
      3. 7.4.3 Alternate Power Supply Topologies
        1. 7.4.3.1 Inverting Power
        2. 7.4.3.2 Split Rail Power Supply
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH® Tools
        2. 8.2.2.2  Selecting the Switching Frequency
        3. 8.2.2.3  Output Inductor Selection (LO)
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Catch Diode
        6. 8.2.2.6  Input Capacitor
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  Undervoltage Lockout Set Point
        9. 8.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 8.2.2.10 Minimum VIN
        11. 8.2.2.11 Compensation
        12. 8.2.2.12 Discontinuous Conduction Mode and Eco-mode Boundary
        13. 8.2.2.13 Power Dissipation Estimate
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Safe Operating Area
    2. 10.2 Layout Guidelines
    3. 10.3 Layout Example
      1. 10.3.1 Estimated Circuit Area
  11. 11器件和文档支持
    1. 11.1 使用 WEBENCH® 工具定制设计方案
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout

Safe Operating Area

The safe operating area (SOA) of the device is shown in Figure 54, through Figure 57 for 3.3 V, 5 V and 12 V outputs and varying amounts of forced air flow. The temperature derating curves represent the conditions at which the internal and external components are at or below the manufacturer’s maximum operating temperatures. Derating limits apply to devices soldered directly to a double-sided PCB with 2 oz. copper, similar to the EVM. Careful attention must be paid to the other components chosen for the design, especially the catch diode. In most of these test conditions, the thermal performance is limited by the catch diode. When operating at high duty cycles or at higher switching frequency the TPS54540’s thermal performance can become the limiting factor.

TPS54540 C056_SLVSBN0.png Figure 54. 3.3V Outputs
TPS54540 C058_SLVSBN0.png Figure 56. 12V Outputs
TPS54540 C057_SLVSBN0.png Figure 55. 5V Outputs
TPS54540 C050_SLVSBN0.png Figure 57. Air Flow Conditions
VIN = 36 V, VO = 12 V

Layout Guidelines

Layout is a critical portion of good power supply design. There are several signal paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade performance.

  • To reduce parasitic effects, the VIN terminal should be bypassed to ground with a low ESR ceramic bypass capacitor with X5R or X7R dielectric.
  • Care should be taken to minimize the loop area formed by the bypass capacitor connections, the VIN terminal, and the anode of the catch diode.
  • The GND terminal should be tied directly to the power pad under the IC and the PowerPAD™.
  • The power pad should be connected to internal PCB ground planes using multiple vias directly under the IC.
  • The SW terminal should be routed to the cathode of the catch diode and to the output inductor.
  • Since the SW connection is the switching node, the catch diode and output inductor should be located close to the SW terminals, and the area of the PCB conductor minimized to prevent excessive capacitive coupling.
  • For operation at full rated load, the top side ground area must provide adequate heat dissipating area.
  • The RT/CLK terminal is sensitive to noise so the RT resistor should be located as close as possible to the IC and routed with minimal lengths of trace.
  • The additional external components can be placed approximately as shown.
  • It may be possible to obtain acceptable performance with alternate PCB layouts, however this layout has been shown to produce good results and is meant as a guideline.

Layout Example

TPS54540 layout_lvsbb4.gif Figure 58. PCB Layout Example

Estimated Circuit Area

Boxing in the components in the design of Figure 35 the estimated printed circuit board area is 1.025 in2 (661 mm2). This area does not include test points or connectors.