ZHCSQ76 December   2022 TPS25961

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 典型特性
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 欠压保护 (UVP) 和欠压锁定 (UVLO)
      2. 7.3.2 Overvoltage Protection
      3. 7.3.3 Inrush Current, Overcurrent and Short Circuit Protection
        1. 7.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 7.3.3.2 Active Current Limiting
        3. 7.3.3.3 Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection (OTP)
      5. 7.3.5 Fault Response
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 典型应用
      1. 8.2.1 Adapter input protection for set-top boxes
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Programming the Current-Limit Threshold: RILM Selection
        2. 8.2.3.2 欠压和过压锁定设定点
        3. 8.2.3.3 Output Voltage Rise Time (tR)
      4. 8.2.4 Application Curves
    3. 8.3 Application Example
      1. 8.3.1 Application Curves
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 瞬态保护
      2. 8.4.2 Output Short-Circuit Measurements
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 商标
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1)(2) TPS25961 UNIT
DRV (SON)
6 PINS
RθJA Junction-to-ambient thermal resistance 74.1 °C/W
RθJCtop Junction-to-case (top) thermal resistance 80.4 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance 16.8 °C/W
RθJB Junction-to-board thermal resistance 39.0 °C/W
ΨJT Junction-to-top characterization parameter 4.9 °C/W
ΨJB Junction-to-board characterization parameter 38.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Based on simulations conducted with the device mounted on a custom 4-layer PCB (2s2p)