ZHCS845A March   2012  – July 2015 TPS2379

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CDB Converter Disable Bar Pin Interface
      2. 8.3.2 CLS Classification
      3. 8.3.3 DEN Detection and Enable
      4. 8.3.4 GATE Auxiliary Gate Driver
        1. 8.3.4.1 External Boost Circuit (Q1, Q2, and RBLST) Considerations
      5. 8.3.5 Internal Pass MOSFET
      6. 8.3.6 T2P Type-2 PSE Indicator
      7. 8.3.7 VDD Supply Voltage
      8. 8.3.8 VSS
      9. 8.3.9 PowerPAD
    4. 8.4 Device Functional Modes
      1. 8.4.1 PoE Overview
        1. 8.4.1.1  Threshold Voltages
        2. 8.4.1.2  PoE Start-Up Sequence
        3. 8.4.1.3  Detection
        4. 8.4.1.4  Hardware Classification
        5. 8.4.1.5  Inrush and Start-up
        6. 8.4.1.6  Maintain Power Signature
        7. 8.4.1.7  Start-up and Operation
        8. 8.4.1.8  PD Hotswap Operation
        9. 8.4.1.9  CDB and T2P
        10. 8.4.1.10 Auxiliary Pass MOSFET Control
        11. 8.4.1.11 Using DEN to Disable PoE
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Input Bridges and Schottky Diodes
        2. 9.2.2.2 Protection, D1
        3. 9.2.2.3 Capacitor, C1
        4. 9.2.2.4 Detection Resistor, RDEN
        5. 9.2.2.5 Classification Resistor, RCLS
        6. 9.2.2.6 External Boost Circuit
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 EMI Containment
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations and OTSD
    4. 11.4 ESD
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对本文档进行修订的情况下发生改变。要获得这份数据表的浏览器版本，请查阅左侧的导航栏。