ZHCSHW4A December   2017  – January 2019 TPS23523

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Relationship between Sense Voltage, Gate Current, and Timer
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Limit
        1. 8.3.1.1 Programming the CL Switch-Over Threshold
        2. 8.3.1.2 Setting Up the PROG Pin
        3. 8.3.1.3 Programming CL1
        4. 8.3.1.4 Programming CL2
      2. 8.3.2 Soft Start Disconnect
      3. 8.3.3 Timer
      4. 8.3.4 Gate 2
      5. 8.3.5 OR-ing
    4. 8.4 Device Functional Modes
      1. 8.4.1 OFF State
      2. 8.4.2 Insertion Delay State
      3. 8.4.3 Start-up State
      4. 8.4.4 Normal Operation State
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Selecting RSNS
        2. 9.2.2.2  Selecting Soft Start Setting: CSS and CSS,VEE
        3. 9.2.2.3  Selecting VDS Switch Over Threshold
        4. 9.2.2.4  Timer Selection
        5. 9.2.2.5  MOSFET Selection and SOA Checks
        6. 9.2.2.6  Input Cap, Input TVS, and OR-ing FET selection
        7. 9.2.2.7  EMI Filter Consideration
        8. 9.2.2.8  Undervoltage and Overvoltage Settings
        9. 9.2.2.9  Choosing RVCC and CVCC
        10. 9.2.2.10 Power Good Interface to Downstream DC/DC
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.1 Design Requirements

The table below summarizes the design parameters that must be known before designing a hot swap circuit. When charging the output capacitor through the hot swap MOSFET, the FET’s total energy dissipation equals the total energy stored in the output capacitor (1/2CV2). Thus both the input voltage and output capacitance will determine the stress experienced by the MOSFET. The maximum load power will drive the current limit and sense resistor selection. In addition, the maximum load current, maximum ambient temperature, and the thermal properties of the PCB (RθCA) will drive the selection of the MOSFET's RDSON and the number of MOSFETs used. RθCA is a strong function of the layout and the amount of copper that is connected to the drain of the MOSFET. Air cooling will also reduce RθCA substantially. Finally, it's important to know what transients the circuit has to pass in order to size up the input protection accordingly.

Table 1. Design Requirements for a –38 V to –60 V, 400-W Protection Circuit

DESIGN PARAMETER EXAMPLE VALUE
Input voltage range –38 V to –60 V
Maximum Load Power 400 W
Output Capacitance 660 µF
Location of Output Cap After EMI filter with ~5 µH of inductance.
Maximum Ambient Temperature 85°C
MOSFET RθCA (function of layout) 20°C/W
Pass “Hot-Short” on Output? Yes
Pass a “Start into short”? Yes
Is the load off until PG asserted? Yes
Max Input Inductance 10 µH
Level of IEC61000-4-5 to pass 2-kV Line to Line with 2-Ω series impedance
Pass Reverse Hook Up Yes