ZHCSQ16 December   2022 TPS22995

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VBIAS = 5 V)
    6. 6.6  Electrical Characteristics (VBIAS = 3.3 V)
    7. 6.7  Electrical Characteristics (VBIAS = 1.5 V)
    8. 6.8  Switching Characteristics (VBIAS = 5 V)
    9. 6.9  Switching Characteristics (VBIAS = 3.3 V)
    10. 6.10 Switching Characteristics (VBIAS = 1.5 V)
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adjustable Slew Rate
      2. 8.3.2 Quick Output Discharge
      3. 8.3.3 ON and OFF Control
      4. 8.3.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS22995 UNIT
6 PINS
RZF(WQFN-HR) RZG(WQFN-HR)
RθJA Junction-to-ambient thermal resistance 143.5 141.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 132.1 133.7 °C/W
RθJB Junction-to-board thermal resistance 47.8 41.2 °C/W
ΨJT Junction-to-top characterization parameter 5.2 5.3 °C/W
YJB Junction-to-board characterization parameter 47.4 40.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.