ZHCSCK3A June   2014  – June 2014 TPS22959

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 简化电路原理图
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics, VBIAS = 5.0 V
    6. 7.6 Electrical Characteristics, VBIAS = 2.5 V
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On/off Control
      2. 8.3.2 Input Capacitor (CIN)
      3. 8.3.3 Output Capacitor (CL)
      4. 8.3.4 VIN and VBIAS Voltage Range
    4. 8.4 Device Functional Modes
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VIN to VOUT Voltage Drop
        2. 9.2.2.2 Inrush Current
        3. 9.2.2.3 Thermal Considerations
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

WSON (DNY) PACKAGE
8 PIN
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Pin Functions

Pin I/O DESCRIPTION
NAME NO.
VIN 1, 2 I Switch input. Place ceramic bypass capacitor(s) between this pin and GND. See the Detailed Description section for more information.
VIN Exposed thermal Pad I Switch input. Place ceramic bypass capacitor(s) between this pin and GND. See the Detailed Description section for more information.
VBIAS 3 I Bias voltage. Power supply to the device.
ON 4 I Active high switch control input. Do not leave floating.
GND 5 Ground.
VOUT 6, 7, 8 O Switch output. Place ceramic bypass capacitor(s) between this pin and GND. See the Detailed Description section for more information.