ZHCSGA2A May   2017  – May 2018 TPL7407LA

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化应用原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inductive Load Drive
      2. 7.4.2 Resistive Load Drive
      3. 7.4.3 ON State Input Current
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Unipolar Stepper Motor Driver
      2. 8.1.2 Multi-Purpose Sink Driver
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 TTL and other Logic Inputs
        2. 8.2.2.2 Input RC Snubber
        3. 8.2.2.3 High-Impedance Input Drivers
        4. 8.2.2.4 Drive Current
        5. 8.2.2.5 Output Low Voltage
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Improving Package Thermal Performance
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Improving Package Thermal Performance

θJA value depends on the PC board layout. An external heat sink and/or a cooling mechanism, like a cold air fan, can help reduce θJA and thus improve device thermal capabilities. Refer to TI’s design support web page at www.ti.com/thermal for a general guidance on improving device thermal performance.