ZHCSEG2 December   2015 TPIC2040

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - Common Part
    6. 7.6  Electrical Characteristics - Charge Pump
    7. 7.7  Electrical Characteristics - LDO Pre Driver Part
    8. 7.8  Electrical Characteristics - Spindle Motor Driver Part
    9. 7.9  Electrical Characteristics - Sled Motor Driver Part
    10. 7.10 Electrical Characteristics - Focus/ Tilt/Tracking/Driver Part
    11. 7.11 Electrical Characteristics - Load Driver Part
    12. 7.12 Electrical Characteristics - Current Switch Part
    13. 7.13 Electrical Characteristics - Actuator Protection
    14. 7.14 Electrical Characteristics - Serial Port Voltage Levels
    15. 7.15 Serial Port I/F Write Timing Requirements
    16. 7.16 Serial I/F Read Timing Requirements
    17. 7.17 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Protect Function
        1. 8.3.1.1 Undervoltage Lockout (UVLO)
        2. 8.3.1.2 Overvoltage Protection (OVP)
        3. 8.3.1.3 Overcurrent Protection (OCP)
          1. 8.3.1.3.1 OCP for Load Driver
          2. 8.3.1.3.2 OCP for CSW
        4. 8.3.1.4 Thermal Protection (TSD)
        5. 8.3.1.5 Actuator Temperature Protection (ACTTIMER)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-on Reset (POR)
        1. 8.4.1.1 Power-Up Sequences
        2. 8.4.1.2 XRESET
      2. 8.4.2 XMUTE
    5. 8.5 Programming
      1. 8.5.1 Serial Port Functional Description
      2. 8.5.2 Write Operation
      3. 8.5.3 Read Operation
      4. 8.5.4 Write and Read Operation
    6. 8.6 Register Maps
      1. 8.6.1 Register State Transition
      2. 8.6.2 DAC Register (12-Bit Write Only)
      3. 8.6.3 Control Register
      4. 8.6.4 Detailed Description of Registers
        1. 8.6.4.1  REG01 12bit DAC for Tilt (VDAC_MAPSW = 0)
        2. 8.6.4.2  REG02 12bit DAC for Focus (VDAC_MAPSW = 0)
        3. 8.6.4.3  REG03 12bit DAC for Tracking (VDAC_MAPSW = 0)
        4. 8.6.4.4  REG04 10bit DAC for Sled1 (VDAC_MAPSW = 0)
        5. 8.6.4.5  REG05 10bit DAC for Sled2 (VDAC_MAPSW = 0)
        6. 8.6.4.6  REG08 12bit DAC for Spindle (VDAC_MAPSW = 0)
        7. 8.6.4.7  REG09 12bit DAC for Load (VDAC_MAPSW = 0)
        8. 8.6.4.8  REG6A 8-Bit Control Register for CSW_OCP (REG6A)
        9. 8.6.4.9  REG6C 8-Bit Control Register for Parm1 (REG6C)
        10. 8.6.4.10 REG6F 8-Bit Control Register for MonitorSet (REG6F)
        11. 8.6.4.11 REG70 8-Bit Control Register for DriverEna (REG70)
        12. 8.6.4.12 REG71 8-Bit Control Register for FuncEna (REG71)
        13. 8.6.4.13 REG72 8-Bit Control Register for ACTCfg (REG72)
        14. 8.6.4.14 REG73 8-Bit Control Register for Parm0 (REG73)
        15. 8.6.4.15 REG74 8-Bit Control Register for OptSet (REG74)
        16. 8.6.4.16 REG75 8-Bit Control Register for TSD_TUP (REG75)
        17. 8.6.4.17 REG76 8-Bit Control Register for WriteEna (REG76)
        18. 8.6.4.18 REG77 8-Bit Control Register for ClrReg (REG77)
        19. 8.6.4.19 REG78 8-Bit Control Register for ActTemp (REG78)
        20. 8.6.4.20 REG79 8-Bit Control Register for UVLOMon (REG79)
        21. 8.6.4.21 REG7A 8-Bit Control Register for TsdMon (REG7A)
        22. 8.6.4.22 REG7B 8-Bit Control Register for ProtMon (REG7B)
        23. 8.6.4.23 REG7E 8-Bit Control Register for Version (REG7E)
        24. 8.6.4.24 REG7F 8-Bit Control Register for Status (REG7F)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  DAC Type
      2. 9.1.2  Example of 12-Bit DAC Sampling Rate for FCS/TRK/TLT
      3. 9.1.3  Digital Input Coding
      4. 9.1.4  Example Timing of Target Control System
      5. 9.1.5  Spindle Motor Driver Part
        1. 9.1.5.1 Spindle PWM Control
        2. 9.1.5.2 Auto Short Brake Function
        3. 9.1.5.3 Spindle Low-Speed Mode
        4. 9.1.5.4 Spindle Driver Current Limit Circuit
      6. 9.1.6  Sled Driver Part
        1. 9.1.6.1 Sled Channel Input versus Output PWM Duty
        2. 9.1.6.2 Sled End Detect Function
      7. 9.1.7  Load Driver Part
      8. 9.1.8  Focus/Track/Tilt Driver Part
        1. 9.1.8.1 Differential Tilt Mode
      9. 9.1.9  9-V LDO
      10. 9.1.10 Monitor Signal on GPOUT
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 器件支持

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.