ZHCSQQ4C November   2011  – June 2022 TPA2015D1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 SpeakerGuard™ Theory of Operation
        1. 9.3.1.1 SpeakerGuard™ With Varying Input Levels
        2. 9.3.1.2 Battery Tracking SpeakerGuard™
      2. 9.3.2 Fully Differential Class-D Amplifier
        1. 9.3.2.1 Advantages of Fully Differential Amplifiers
        2. 9.3.2.2 Improved Class-D Efficiency
      3. 9.3.3 Adaptive Boost Converter
        1. 9.3.3.1 Boost Converter Overvoltage Protection
      4. 9.3.4 Operation With DACs and CODECs
      5. 9.3.5 Filter Free Operation and Ferrite Bead Filters
      6. 9.3.6 Speaker Load Limitation
      7. 9.3.7 Fixed Gain Setting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Battery Tracking SpeakerGuard™ Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2015D1 With Differential Input Signals
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Boost Converter Inductor Selection
            1. 10.2.1.2.1.1 Inductor Equations
          2. 10.2.1.2.2 Boost Converter Capacitor Selection
          3. 10.2.1.2.3 Components Location and Selection
            1. 10.2.1.2.3.1 Decoupling Capacitors
            2. 10.2.1.2.3.2 Input Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2015D1 with Single-Ended Input Signals
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Placement
      2. 12.1.2 Trace Width
      3. 12.1.3 Pad Size
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
        1. 13.1.1.1 TPA2015D1 Glossary
        2. 13.1.1.2 Boost Terms
    2. 13.2 Community Resources
    3. 13.3 Trademarks
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.1.2 Trace Width

Recommended trace width at the solder balls is 75 μm to 100 μm to prevent solder wicking onto wider PCB traces. For high current pins (SW, GND, OUT+, OUT–, PVOUT, and PVDD) of the TPA2015D1, use 100 μm trace widths at the solder balls and at least 500 μm PCB traces to ensure proper performance and output power for the device. For low current pins (IN–, IN+, END, ENB, GAIN, AGC, VBAT) of the TPA2015D1, use 75 μm to 100 μm trace widths at the solder balls. Run IN- and IN+ traces side-by-side (and if possible, same length) to maximize common-mode noise cancellation.