SBOS383D December 2006 – December 2016 TMP411
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Input voltage | Pins 2, 3, 4 only | –0.5 | VS + 0.5 | V |
Input voltage | Pins 6, 7, 8 only | –0.5 | 7 | V |
Input current | 10 | mA | ||
Power supply, Vs | 7 | V | ||
Operating temperature range | –55 | 127 | °C | |
Junction temperature, TJ(max) | 150 | °C | ||
Storage temperature, Tstg | –60 | 130 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±3000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
V+ | Supply voltage | 2.7 | 3.3 | 5.5 | V |
TA | Operating free-air temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TMP411 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DGK (VSSOP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 112.3 | 166.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 59.4 | 58.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 53.0 | 86.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 13.6 | 7.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 52.4 | 85.2 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
TEMPERATURE ERROR | ||||||||||||
TERROR(LOCAL) | Local temperature sensor | TA = –40°C to 125°C | –2.5 | ±1.25 | 2.5 | °C | ||||||
TA= 15°C to 85°C VS = 3.3 V |
–1 | ±0.25 | 1 | °C | ||||||||
TERROR(REMOTE) | Remote temperature sensor(1) | TA = 15°C to 75°C TDIODE = –40°C to 150°C VS = 3.3 V |
–1 | ±0.0625 | 1 | °C | ||||||
TA = –40°C to 100°C TDIODE = –40°C to 150°C VS = 3.3 V |
–3 | ±1 | 3 | °C | ||||||||
TA = –40°C to 125°C TDIODE = –40°C to 150°C VS = 3.3 V |
–5 | ±3 | 5 | °C | ||||||||
TERROR_PS | Temperature error power supply sensitivity (local and remote) | VS = 2.7 V to 5.5 V TDIODE = –40°C to 150°C |
–0.5 | ±0.2 | 0.5 | °C/V | ||||||
TEMPERATURE MEASUREMENT | ||||||||||||
Conversion time (per channel) | One-shot mode | 105 | 115 | 125 | ms | |||||||
Resolution | Local temperature sensor (programmable) | 9 | 12 | Bits | ||||||||
Remote temperature sensor | 12 | Bits | ||||||||||
Remote sensor source currents | High | Series resistance: 3 kΩ maximum | 120 | µA | ||||||||
Medium high | 60 | µA | ||||||||||
Medium low | 12 | µA | ||||||||||
Low | 6 | µA | ||||||||||
η | Remote transistor ideality factor | Optimized ideality factor | 1.008 | |||||||||
SMBUS INTERFACE | ||||||||||||
VIH | Logic input high voltage (SCL, SDA) | 2.1 | V | |||||||||
VIL | Logic input low voltage (SCL, SDA) | 0.8 | V | |||||||||
Hysteresis | 500 | mV | ||||||||||
SMBus output low sink current | 6 | mA | ||||||||||
Logic input current | –1 | 1 | µA | |||||||||
SMBus input capacitance (SCL, SDA) | 3 | pF | ||||||||||
SMBus clock frequency | 3.4 | MHz | ||||||||||
SMBus timeout | 25 | 30 | 35 | ms | ||||||||
SCL falling edge to SDA valid time | 1 | µs | ||||||||||
DIGITAL OUTPUTS | ||||||||||||
VOL | Output low voltage | IOUT = 6 mA | 0.15 | 0.4 | V | |||||||
IOH | High-level output leakage current | VOUT = Vs
|
0.1 | 1 | µA | |||||||
ALERT or THERM2 output low sink current | ALERT/THERM2 forced to 0.4 V | 6 | mA | |||||||||
THERM output low sink current | THERM forced to 0.4 V | 6 | mA | |||||||||
POWER SUPPLY | ||||||||||||
VS | Specified voltage range | 2.7 | 5.5 | V | ||||||||
IQ | Quiescent current | 0.0625 conversions per second VS = 3.3 V |
28 | 30 | µA | |||||||
Eight conversions per second VS = 3.3 V |
400 | 475 | µA | |||||||||
Serial bus inactive, shutdown mode | 3 | 10 | µA | |||||||||
Serial bus active, fS = 40 kHz, shutdown mode | 90 | µA | ||||||||||
Serial bus active, fS = 3.4 MHz, shutdown mode | 350 | µA | ||||||||||
Undervoltage lockout | 2.3 | 2.4 | 2.6 | V | ||||||||
POR | Power-on-reset threshold | 1.6 | 2.3 | V |
MIN | NOM | MAX | UNIT | |||
---|---|---|---|---|---|---|
f(SCL) | SCL operating frequency | Fast mode | 0.001 | 0.4 | MHz | |
High-speed mode | 0.001 | 3.4 | ||||
t (BUF) | Bus free time between STOP and START condition | Fast mode | 600 | ns | ||
High-speed mode | 160 | |||||
t (HDSTA) | Hold time after repeated START condition. After this period, the first clock is generated | Fast mode | 100 | ns | ||
High-speed mode | 100 | |||||
t (SUSTA) | Repeated START condition setup time | Fast mode | 100 | ns | ||
High-speed mode | 100 | |||||
t (SUSTO) | STOP condition setup time | Fast mode | 100 | ns | ||
High-speed mode | 100 | |||||
t (HDDAT) | Data hold time | Fast mode | 0 (1) | ns | ||
High-speed mode | 0 (2) | |||||
t (SUDAT) | Data setup time | Fast mode | 100 | ns | ||
High-speed mode | 10 | |||||
t (LOW) | SCL clock LOW period | Fast mode | 1300 | ns | ||
High-speed mode | 160 | |||||
t (HIGH) | SCL clock HIGH period | Fast mode | 600 | ns | ||
High-speed mode | 60 | |||||
t F | Clock and data fall time | Fast mode | 300 | ns | ||
High-speed mode | 160 | |||||
t R | Clock and data rise time | Fast mode | 300 | ns | ||
High-speed mode | 160 | |||||
SCLK ≤ 100 kHz | Fast mode | 1000 | ||||
High-speed mode |