ZHCSJ82B
December 2009 – December 2018
TMP20
PRODUCTION DATA.
1
特性
2
应用
3
说明
器件框图
器件静态电流与温度间的关系
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Transfer Function
7.3.1.1
Example 1
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
Output Drive and Capacitive Loads
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
器件支持
11.1.1
TINA-TI(免费下载软件)
11.1.1.1
针对 TMP20 使用基于 SPICE 的 TINA-TI 模拟仿真程序
11.1.2
开发支持
11.2
接收文档更新通知
11.3
社区资源
11.4
商标
11.5
静电放电警告
11.6
术语表
12
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
DCK|5
MPDS025H
DRL|6
MPDS159F
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsj82b_oa
zhcsj82b_pm
6.6
Typical Characteristics
Figure 1.
Output Impedance vs Temperature
Figure 3.
Output Voltage vs Temperature
Figure 5.
Power-Supply Rejection vs Temperature
Figure 7.
Temperature Error vs Temperature
Figure 9.
Wideband Output Noise Voltage
Figure 2.
Quiescent Current vs Temperature
Figure 4.
Quiescent Current vs Supply Voltage
Figure 6.
Power-Supply Rejection vs Temperature
Figure 8.
Minimum Supply Voltage vs Temperature
Figure 10.
Thermal Settling (Fluid-Filled Temperature Bath)