ZHCSMJ5F
june 2010 – december 2020
TLV809
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
Switching Characteristics
7.8
Timing Diagrams
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Supply Voltage Monitoring
8.3.2
RESET Output
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.1.1
VDD Transient Rejection
9.1.2
Reset During Power-Up and Power-Down
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
支持资源
12.3
Trademarks
12.4
静电放电警告
12.5
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DBV|3
MPDS017N
DBZ|3
MPDS108E
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsmj5f_oa
zhcsmj5f_pm
12.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。