ZHCSF07A March   2016  – January 2017 TLV62095

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 Power Save Mode Operation
      3. 7.3.3 Low Dropout Operation (100% Duty Cycle)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Soft Startup (SS) and Hiccup Current Limit During Startup
      3. 7.4.3 Voltage Tracking (SS)
      4. 7.4.4 Short Circuit Protection (Hiccup-Mode)
      5. 7.4.5 Output Discharge Function
      6. 7.4.6 Power Good Output
      7. 7.4.7 Undervoltage Lockout
      8. 7.4.8 Thermal Shutdown
      9. 7.4.9 Charge Pump (CP, CN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.8-V Output Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Filter
          3. 8.2.1.2.3 Inductor Selection
          4. 8.2.1.2.4 Input and Output Capacitor Selection
          5. 8.2.1.2.5 Setting the Output Voltage
        3. 8.2.1.3 Application Performance Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 开发支持
        1. 11.1.2.1 使用 WEBENCH® 工具定制设计方案
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Voltage at pins(2) PVIN, AVIN, FB, SS, EN, DEF, VOS – 0.3 7 V
SW (DC), PG – 0.3 VIN+0.3
SW (AC, less than 10 ns)(3) – 3.0 10
CN, CP – 0.3 VIN+7.0
Sink current PG 1.0 mA
Operating junction temperature range, TJ – 40 150 °C
Storage temperature, Tstg – 65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
(3) While switching.

6.2 ESD Ratings

MAX UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommend Operating Conditions

MIN MAX UNIT
VIN Input voltage range 2.5 5.5 V
TJ Operating junction temperature -40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TLV62095 UNIT
VQFN (16 PINS)
RθJA Junction-to-ambient thermal resistance 47 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60
RθJB Junction-to-board thermal resistance 20
ψJT Junction-to-top characterization parameter 1.5
ψJB Junction-to-board characterization parameter 20
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

VIN = 3.6V and TJ = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
VIN Input voltage range 2.5 5.5 V
IQ Quiescent current into PVIN and AVIN EN = High, Not switching, FB = FB +5% 20 µA
ISD Shutdown current Into PVIN and AVIN EN = Low 0.6 µA
VUVLO Undervoltage lockout threshold VIN falling 2.1 2.2 2.3 V
Undervoltage lockout hysteresis 200 mV
TSD Thermal shutdown Temperature rising 150 ºC
Thermal shutdown hysteresis 20 ºC
CONTROL SIGNAL EN
VH High level input voltage VIN = 2.5 V to 5.5 V 1 0.65 V
VL Low level input voltage VIN = 2.5 V to 5.5 V 0.60 0.4 V
Ilkg Input leakage current EN = GND or VIN 10 100 nA
RPD Pull down resistance EN = Low 400 kΩ
SOFT STARTUP
ISS Softstart current 7.5 µA
POWER GOOD
VTH_PG Power good threshold Output voltage rising 95%
Output voltage falling 90%
VL Low level voltage I(sink) = 1 mA 0.4 V
POWER SWITCH
RDS(on) High side FET on-resistance ISW = 500 mA 50 mΩ
Low side FET on-resistance ISW = 500 mA 40 mΩ
ILIM High side FET switch current limit 4.7 5.5 A
fSW Switching frequency IOUT = 3 A 1.4 MHz
OUTPUT
VOUT Output voltage range 0.8 VIN V
RDIS Output discharge resistor EN = GND, VOUT = 1.8 V 200 Ω
VFB Feedback regulation voltage IOUT = 1 A, PWM mode 792 800 808 mV
Line regulation VOUT = 1.8 V, PWM operation 0.016 %/V
Load regulation VOUT = 1.8 V, PWM operation 0.04 %/A

6.6 Typical Characteristics

TLV62095 D003_SLVSBD8_TPS62095.gif Figure 1. High-Side FET On Resistance
TLV62095 D005_SLVSBD8_TPS62095.gif Figure 3. Quiescent Current
TLV62095 D004_SLVSBD8_TPS62095.gif Figure 2. Low-Side FET On Resistance
TLV62095 D006_SLVSBD8_TPS62095.gif Figure 4. Shutdown Current